The revolution in photonics packaging has arrived!
For over 2 years now RJR Technologies (RJR Technologies, Inc.), is in an ongoing collaboration between the Chip Integration Technology Center (CITC), to develop a Low-Cost, Air-Cavity Package for?Photonics Integrated Circuits (PICs) utilizing existing air-cavity (ACP) RF power package solutions with LCP injection molding technology. Based on the existing Semicon RF power experience, this technology offers the photonics world a scalable high-volume packaging solution and lead frame based assembly. This really creates the opportunity to go for cost-effective high-volume mass production.
The technology allows for many different package layouts, as shown in one of my previous posts:
RJR is in ongoing discussions with several photonics OSATs and end-customers. Recently RJR announced a formal collaboration with PHIX. PHIX, a European packaging foundry, specializes in all major PIC (Photonic Integrated Circuit) technology platforms. It provides assembly services and contract manufacturing for PICs and MEMS. With a recently established state-of-the-art production facility in Enschede, the Netherlands, PHIX has positioned itself as a key player in the European OSAT ecosystem for photonics.
Wil Salhuana, CEO of RJR Technologies, stated, "As we introduce advanced photonics packages built on the proven performance of our established RF packages—offering best-in-class performance, rapid time to market, and cost efficiency—PHIX emerged as the ideal OSAT partner to provide comprehensive backend solutions for our customers."
At the Optica online industry meeting on Photonic Integrated Circuits (PICs) packaging for volume manufacturing (25 February 2025 10:00 - 11:30 hrs CET), I will present a short elevator pitch in RJRs Technology. This event gathers industry leaders to discuss transformations in PIC packaging to meet mass manufacturing demands, similar to CMOS microelectronics. This event will explore strategies for high throughput and yield, essential in today's tech landscape.The meeting will tackle challenges in PIC assembly, such as precision alignment, thermal management, and co-packaging with electronic components. They will also discuss the shift towards wafer-level processes required for increased production volumes, encouraging collaboration and innovative solutions for mainstream volume PIC manufacturing.?
领英推荐
If you like to meet me, have questions or would like to receive some demo samples yourself, please contact me:
Deep Tech PR Expert focused on the Semiconductor Industry
1 周Congratulations, Wil. This is very exciting news.
Always good to hear from you
3 周I often thought that hermetic sealing with an inert gas like nitrogen is beneficial to prevent condensation and contamination. Especially when used with a TEC. Is this technology now truly hermetic?
Plastic DIL packaging used back in the 1980’s
Photonics & Mems Packaging Development at STMicroelectronics
3 周I First started work evaluating this RJR's technology for ooro packages 20 years ago, the company I was working with at the time did not move forward with it, but it is in use in non opto microelectronics packages for some considerable time.
Long time ago (decades...) a Japanese company was following up a similar approach. They were probably to early to reach market accaptence as those days people were only accepting hermetic gold boxes... Intereresting and good to see these innovative ideas are taking off now. Later as expected. I still remember these discussions "we will never ever use any epoxy for photonics" or "your idea of using foundries for photonics components will never ever take off"...