Review: 17th Connectors Congress
Data, signals and power - connectors form the backbone of electronic systems in all industries. From materials, plastics and coatings, miniaturized connectors, 3D printing to tips for cable assembly, the topics discussed at the Connector Congress ( Steckverbinderkongress ) in Würzburg ranged. And the topic of sustainability took up a lot of space. In addition to technical information, maintaining existing contacts and establishing new connections was an important concern for participants.
Industry builds on sustainable connections
"We are a surface specialist, but connectors have not been in our focus so far - but this congress is a great opportunity to get comprehensive information on the subject and at the same time make promising new contacts," said Jacko Pijper , Global Business Manager from the Canadian company Optimum Anode Technologies , summing up his experience of three days at the Connector Congress.
422 participants as well as 56 speakers and 56 exhibiting companies met at the 17th Steckverbinderkongress at the Vogel Convention Center in Würzburg, Germany, to learn about current trends, practical experience, research and developments at Europe's largest event on this topic.
In addition to materials, surfaces and coatings, high-speed and DC connectors, single pair Ethernet, 3D manufacturing and cable assembly, measurement methods and standards, the topic of "Sustainability in the Connector Industry" took up a great deal of space.
Thus, after the basic seminars on characteristic values and fundamentals, materials and surface coating, and the selection of plastics for connectors, the first day of the congress was devoted in detail to the topic of "Product Carbon Footprint" (PCF) in the afternoon.
Georg Steinberger , Chairman of the Board of FBDI e.V. - Fachverband Bauelemente Distribution , placed his keynote speech under the motto "Sustainability - Those who talk too much live longer", and in the subsequent panel discussion, Dr. Simon Althoff ( Weidmüller Deutschland ), Dr. Isabell Buresch and Jan Van Cauwenberge (TE Connectivity), Christian Eckert ( ZVEI e. V. ), Ilhan K?rbulak ( OTMK Group ), Carsten Niermann ( AKRO-PLASTIC GmbH ), Wiebke Speckels ( BASF Polyuréthanes France S.A.S. ), Dr. Martin Sch?fers ( Phoenix Contact ) and Georg Steinberger on sustainability in the connector industry: After all, the CO2 footprint at product level is a very complex issue, with a great deal currently in flux in production processes. There is already a need for action on the part of manufacturers and suppliers, but also OEMs. The nine experts tried to provide answers to what manufacturers and customers have to be prepared for, how specifications and data are to be interpreted, and how to maneuver through the bureaucratic jungle.
Exciting format: Poster Slam
The first day was rounded off by a poster slam: based on a "poetry slam" (a competition in which self-written texts are presented within a short time), ten speakers were able to present their posters (an overview of the topics on which information was provided at the respective exhibitor stand) to the audience in short 3-minute presentations - who then rated each presentation:
The Poster Slam was very well received by the audience. The presentation by Thomas Frey , sales manager of Gerweck GmbH Oberfl?chentechnik , was chosen as the best contribution.
The idea for the Poster Slam came from Kristin Rinortner , editor of ELEKTRONIKPRAXIS at Vogel Communications Group AG and responsible for the Steckverbinderkongress : "I had already experienced an Electronic Slam at one of our exhibitors, Lacon Electronic GmbH , which was an exciting format - and I adapted it for the congress. As a result, the posters are now getting much more attention."
This was also confirmed by Ilhan K?rbulak , Managing Director of OTMK Group : "We have been participating in the congress since 2015 and have noticed that the topics of surface technology and materials, in which we are at home, are taking up more and more space - in the presentations, in the discussions and at the evening event. We've also been involved with the posters for years, but we've never had such a response as we did after the poster slam - it went down extremely well."
CO2 footprint of connectors
The topic of sustainability also permeated many of the presentations on the second day of the congress: for example, Alexander Hornung ( St?ubli Electrical Connectors and spokesperson for the ZVEI e. V. PCF Connectors working group) and Marion Graupner ( ZVEI e. V. ) addressed the CO2 footprint of connectors and the challenges of reducing it by means of an application example in their keynote address. The presentation gave an overview of terminology and regulatory requirements and presented the results from the PCF Connectors working group (PCF = product carbon footprint). In this, existing open source software systems and databases were evaluated and, based on this, starting points for a calculation basis were defined. The aim is to establish a uniform reporting format for different customer requirements and to design a transparent methodology for determining, detailing and disseminating greenhouse gas emission data while safeguarding company-specific interests.?
A guide to the requirements and implementation of the calculation is available here. And what the PCF value of a connector has to do with eleven cups of coffee, you can find out in this article.
The presentation by Dr. Isabell Buresch and Jan Van Cauwenberge , both TE 中国 , also dealt with the PCF. They presented ways to make material utilization more efficient in combination with the design and production process, to combine performance and miniaturization in the best possible way, and to develop new innovative surface coating processes and layer systems suitable for the application.
Johann Ried and Martin Sch?fers, both from Phoenix Contact , then addressed the technical challenges of switching to lead-free connectors. Lead-free will be mandatory by mid-2026 and will pose challenges for the metal and electrical industry that should not be underestimated. It was shown why the essentially important properties of machinability and cold formability are opposed in connectors made of lead-free alloys. In addition to this, there are other challenges that can be met through technical innovations, supplier communication and continuous further development of materials, tools and machines.
DC connectors: requirements and solutions
Mathias Ohsiek and Marc Klimpel (both Phoenix Contact ) addressed the question of the required qualities of connectors in DC networks in their presentation: because in DC networks, it must be taken into account that capacitive and inductive loads, for example, can have an influence on the service life of the connectors. This is because different load collectives have different effects on their functionality. For example, a high capacitive load can cause high inrush currents to flow for a short time, which can damage the contacts and thus impair their functionality. A high inductive load, on the other hand, can lead to material and user hazards during disconnection. The connectors must be adapted accordingly.
In his presentation, Florian Vogel ( Beckhoff Automation ) addressed standardized connectors with an eye to the future - because machines and systems increasingly need to be able to be flexibly set up and converted in order to cost-effectively meet the increasing demands for segmentation of machine modules, one-piece flow and individualization of consumer goods. In addition to plug-and-play solutions in the connector and software area, the decentralized approach of devices, such as servo drives, power supply units or PLC controllers, is one of the drivers for the flexible and fast reactions to special events that are necessary for this. The IEC standardization project 61076-2-118 is intended to provide device and connector manufacturers, as well as machine and system builders, with a platform for working through, solving and rethinking current and future problems of decentralized technology.
Electrothermal Characteristics: Simulation and AI
Hybrid test simulations and AI-supported models for providing electrothermal parameters of connectors were presented by Dr. Wilhelm Rust from WAGO . As an alternative to the classic test series, he described the determination of electrothermal parameters in a hybrid process of laboratory test and simulation. Starting from the virtual model, artificial intelligence methods are used to expand the database to include individual load profiles and ambient temperatures. Instead of a rigid data sheet, such a model enables the planner as customer to individually and interactively query product data from the connector manufacturer.
"The square must go in the round" - this was the title of Gert Havermann from HARTING Technology Group 's presentation on the challenges of qualifying the RF properties of data connectors. This is because measurement technology is very limited at high frequencies and data rates with regard to electrical interfaces. There are few measurement and test devices that offer an alternative to the coaxial connector. If they are not coaxial interfaces, they are almost always application-specific devices such as network testers or cable testers (USB or LAN).?
However, these devices do not provide any insight into the performance of components belonging to an application, such as connectors or cables; here, general high-frequency measurement technology must be used. Thus, in these cases the problem arises that the 'square has to go into the round' - i.e. a suitable bridge has to be built from the test object to the coaxial test port.
SPE: Signal integrity and range
In his presentation, Sebastian Stamm , Phoenix Contact , described the consequences of the constantly increasing demands on the performance of connection technology: Because with the ever-increasing networking of modern devices, the number of interfaces is also increasing. The goal is to achieve the highest possible signal integrity, i.e. data transmission that is impaired as little as possible.
One connector property that is directly related to signal integrity is impedance. Deviations from the nominal impedance reflect the data signal back to the transmitter. If the reflections become too high, the reflected and transmitted signals overlap. This can lead to interference in a transmission system. Using practical examples from the development of the Single Pair Ethernet portfolio at Phoenix Contact, he explained how the influencing variables can be used specifically during product development to optimize signal integrity and impedance.
"Getting 100 meters with 100 Mbit, is that possible?" The answer was given by Simon Seereiner , Weidmüller Deutschland , and Matthias Karcher , Microchip Technology Inc. in their joint presentation: The IEEE specifications define minimum requirements for the range of single pair Ethernet connections. In the case of 100BASE-T1, the 802.3bw specification calls for a minimum of 15 meters. However, practical implementations can far exceed these minimum requirements. Proper selection of cables, connectors, and semiconductor components results in communication channel characteristics that enable a range of more than 100 m, as demonstrated in the presentation with an example implementation. This means that the same applications can be served with single-pair Ethernet transmissions as with two- or four-pair Ethernet transmissions, which are widely used today.
Manufacturing: 3-D Printing and Automated Fabrication
Dr. Sonja Baumgartner , Cubicure , and Dr. Alexander Starnecker , Weisser Spulenk?rper GmbH & Co. KG , explained in their presentation how "Hot Lithography: flexibility through digital production" can help manufacturers reconcile customer-specific requirements, a wide range of quantities and short delivery times. Additive manufacturing provides the necessary production flexibility and design freedom. Cubicure's printing technology and extensive materials portfolio, combined with scalable post processing, also bridge the gap from prototyping to producing millions of sales-ready parts per year. With their electrical and insulation properties, Cubicure FR materials meet the need for flame-retardant and heat-resistant materials. Leading solution providers have already evaluated the hot lithography process as a tool-less manufacturing alternative to injection molding, and promising application examples from various manufacturers have been demonstrated.
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The automated assembly of connectors using industrial robots as well as challenges and solutions were described by Sven Dittus , ArtiMinds Robotics , in his presentation. In order to remain competitive despite higher wage levels in Europe, more and more companies are deciding to automate their processes. The processes and components developed over many decades in the cable and connector assembly sector were designed and optimized for manual production and present companies with quite a few challenges when it comes to automation. Sven Dittus gave not only application-related solution approaches but also a recommendation for action, which problems can be solved by means of flexible robotics and for which boundary conditions the classic special machine construction is the more suitable way.
Workshops
In addition to the presentations, hands-on workshops were held on the second and third days of the congress. The topics this year:
And in the workshop "Qualification of cable assemblies for industrial applications", Werner H?ring, Head of Industrial Engineering Electromechanics at Lacon Electronic GmbH Electronic, and Joachim de Buhr , Product Specialist Components at Euroconnectors , explained, among other things, which cable and which connector the user needs for perfect cable assembly, or which connection method, such as crimping, soldering or ultrasonic sealing, is suitable from the point of view of quality, batch numbers and costs. The participants learned to assess technical requirements, processes and quality characteristics and also to evaluate them from an economic point of view: when is ultrasonic welding worthwhile, why is it usually more cost-effective and more reliable in the end to have cables assembled by a reliable service provider than to crimp or solder them themselves? Why can a connection that is perfect after tensile measurement still be faulty and how can this be detected? The participants were provided with practical information on the qualification of cable assemblies for industrial applications and were given a practice-oriented insight into the parameterization of sophisticated cable assemblies: Material selection, process qualification, production, quality assurance and cost optimization.
Evening event at the Nikolaushof
At the end of the second day of the congress, the traditional evening event, which took place in beautiful weather at the Nikolaushof Würzburg with a unique view over the city, once again offered plenty of space for professional and personal exchange. "The Nikolaushof was a very good choice for the evening event," stated Andreas Zipser , Executive Consultant at PGUB Management Consultants GmbH , for example. "We had very good contacts at the congress and were then able to deepen the discussions further in the evening. Above all, the topic of sustainability is now of great importance to our customers. And there were many technical presentations, overviews and trends at the congress. In my opinion, the topic has now completely arrived in the industry, especially in the automotive sector, which is important for us. The connector congress showed me what the current status is and what developments are still in store for us. This is an important basis for future discussions with my customers, and the topic was also taken up again and again at the evening event."
Paola Hernandez , Product Development Engineer eProducts at 博格华纳 , had a similar opinion of the evening event and the event as a whole: "The great location of the evening event was a relaxed setting to continue the discussions from the congress. It was my first time at the event, and I was able to take away a lot of information and ideas. For example, sustainability is also an important topic at our company, so the relevant presentations were very informative about the possibilities that now exist in the field of connectors. And I was particularly interested in plastics in the connector sector; there were also very content-rich lectures and basic seminars on this."
Printed circuit board connectors: miniaturization and high speed
The topic of plastics and connectors was also addressed in several presentations on the third day of the event. First, however, the presentation by Silas Dobler and Thilo Maier, METZ CONNECT GmbH , focused on the requirements for miniaturized PCB connectors and the need for miniaturization of terminal technology explained using space-constrained example applications. Terminal manufacturers and device developers are cooperating to design universal solutions to key challenges in terms of performance (functional diversity), ease of use (e.g., overhead mounting,) and electrical specifications (pitch and conductor cross-section). The two speakers outlined measures for miniaturization: Adaptation of terminal bodies, housings and materials for increased requirements. Using space-saving push-in single terminal blocks, it was shown how many requirements can be implemented without sacrificing advantages, including low overall height (6.6 mm), appearance (color coding), flexible placement and shortest connection time.
In their presentation, Thomas Schulze and Arndt Schafmeister , Phoenix Contact , described the special requirements that the transmission of high-frequency data signals within a device between PCBs places on the board-to-board connectors to be used.
They showed how high data integrity can be achieved with impedance-optimized board-to-board connectors as well as their pin assignment and the corresponding PCB layer structure. Corresponding simulations and measurements were presented and their results and parameters explained. These include not only the impedance curve but also the attenuation and reflection behavior as well as crosstalk effects caused by adjacent differential signal pairs or single-ended signals.
The challenge of press-fit technology
In his presentation, Hermann Eicher , ept GmbH , highlighted the challenges posed by press-fit technology as an alternative to soldering technology: "The press-fit zone has proven itself in the automotive industry as an alternative solution to soldering technology for decades and is used primarily in safety-critical applications such as airbags, ABS and engine control units. In order to achieve optimum robustness and the lowest possible failure rate in the application, the geometry and material selection of the press-fit zone, the through-hole plating in the PCB and the suitable process for PCB assembly must already be defined in the design-in process. In the presentation, Hermann Eicher went into the basics and advantages of the press-fit zone, reparability and sustainability.
In their presentation, Andreas Zitz and Dr. Ing. Felix GREINER , TE 中国 , gave an insight into the requirements for technical cleanliness in the automotive industry in connection with connectors and the approaches to achieving this. In the automotive sector, the importance of component cleanliness has steadily increased since the publication of VDA 19.1 in 2005 and later ISO 16 232, especially for electrotechnical components, assemblies and units. These specifications do not specify any concrete cleanliness limits. However, the analysis system that has been introduced makes contaminations visible that previously went unnoticed. A working group of the ZVEI was formed to record the current state in the electrical engineering sector, to identify sources of contamination and possible improvements. One of the studies dealt with the comparison of different cleaning methods and their performance. Furthermore, series of measurements were carried out for a calculation model which provided a possibility to determine the risk of an electrical potential short circuit approximately and to define the required cleanliness limit values more pragmatically.
Surface coatings: Silver and lubricants
"Overcoming Cold-Welding in Silver Contact Finish" was the topic presented by Dr. Adolphe Foyet , DuPont Electronics & Industrial . High-performance electronic components require modern electrical contacts to have high conductivity, low coefficient of friction (COF), high durability and thermal stability for easy and reliable signal and power transmission. The high corrosion and wear resistance of hard gold has led to its use as the industry standard for reinsertable contact surfaces, but a lower-cost alternative is desired. Dr. Adolphe Foyet presented a wear-resistant silver contact coating prepared from a cyanide-free acidic electrolyte. This coating exhibits exceptionally low COF over 10,000 wear cycles without external lubrication and maintains the low contact resistance required for efficient power and signal transmission. This coating also exhibits excellent thermal stability, providing consistent wear and electrical performance over extended thermal aging and enabling reliable operation in high temperature environments.
Bernd Schneemann , FUCHS LUBRICANTS CO. Co, presented a selection guide for lubricants for electrical contacts. Lubricants are an essential design element to maintain and improve the functionality of electrical connectors. In order to meet the technical requirements, the selection of the appropriate lubricant is essential, taking into account the application-specific ambient conditions, chemical composition as well as the desired application method. The characteristics of the lubricant are derived from the general conditions of the application. Correctly selected, lubricants increase service life, improve performance and reduce the failure rate of electrical contacts.
Plastics for connectors
In his presentation "Plastic material in connector industry", Pierre Martin from Wurth Elektronik France addressed the consequences in case of disruptions in the raw material supply chain and how players in the connector industry can find reliable alternatives for critical plastics without reducing the technical specifications of the final product in terms of electrical, thermal and mechanical properties as well as environmental requirements. Using examples, Pierre Martin showed which insulation material is best suited for each type of connector (SMT solder, THT solder, GW compliant, with interlocking functions, etc).
In the final presentation of the Steckverbinderkongress 2023, Andreas Nixdorf , 巴斯夫 SE, explained the requirements for plastics for high-voltage connectors: "Ultramid and Ultradur in color-stable orange for high-voltage connectors". This is because battery-powered vehicles require new components in the electric powertrain. High-voltage (HV) connectors are essential for coupling the battery and electric motor. For safety reasons, most of these components are pre-colored orange (in Europe RAL 2003). For HV connectors, the so-called CTI (Comparative Tracking Index) of 600 is often required. In terms of flame resistance, various UL tests are essential (e.g. UL94 V0 rating). In addition, hydrolysis resistance, good mechanical performance and color stability are important product characteristics. Recent trends show a demand for laser-markable products. The goal is to map the ideal component to meet any requirement. And in terms of color stability, PA6 and PA66 are the focus of further development. While PBT has good color stability, polyamides tend to turn brownish under the influence of heat and aging. The latest achievements are PA6 as well as PA66, which maintain their bright orange color stably even after heat aging (130 °C / 1000 h).
EMC: Interference immunity of connector applications
The fact that the topic of connectors and plastics is becoming increasingly important for users is also shown by the statement of Christiane Eckwerth , Head of Department Product Management Connecting Technology at ifm : "This was my first time at the Steckverbinderkongress and I find it a very successful, well-organized event with very many informative elements: in addition to the lectures, the basic seminars, workshops and the poster slam, and for relaxed consolidation, a nice evening event. PCB interconnects are less my topic now, but everything around sensor technology, 3D printing and SPE I found very informative. And I was particularly interested in the presentations on materials, surfaces and plastics. On the other hand, the topics of shielding and EMC were a little too short for me - these are becoming increasingly important for us, and there could have been more presentations on them."
The organizer is open to this suggestion, as Kristin Rinortner explains: "We see the topic of EMC becoming increasingly important. The Steckverbinderkongress 2024, which will take place from June 3 to 5, 2024, will therefore place a major focus on 'EMC' on the first day of the congress."
Further information on this, as well as the detailed program of this year's event with summaries of the presentations and workshops and an extensive picture gallery with numerous impressions, can be found on the homepage of the Connector Congress. [hjs]