Research on fingerprint FPC board
The uniqueness and invariance of the fingerprint itself make the security performance of the fingerprint identification technology in the identification system greatly improved compared with the traditional password-based identification method, and it is more and more attractive for FPC factories and institutions to study it. It is also widely used in civilian products, such as fingerprint locks, attendance machines, mobile phones and vehicle-mounted equipment. However, due to the complex, lengthy and immature design of the fingerprint module manufacturing process, it is the key to the fingerprint module manufacturing process to study how to improve the fingerprint module manufacturing process and improve the efficiency.
In view of the problems existing in the existing fingerprint module manufacturing process, such as surface scratches, oil deposits on the edges, and other problems in the spraying process, the high proportion of defective products, the wide variety of fixtures and the low loading and unloading efficiency, the cumbersome process flow, reliability, and assembly gaps, etc. The performance of the solder paste used in the fabrication process, the design of the chip pad structure and the assembly process were analyzed and improved, which improved the product quality and production efficiency of the fingerprint module to a certain extent. The specific research contents are summarized as follows:
(1) By analyzing the performance of low-temperature solder paste, the introduction of low-temperature solder paste material instead of high-temperature solder paste realizes the possibility of first spraying and then soldering the full-page chips. The original method that needs to be cut into a single chip and then sprayed is changed to direct full-page The chip is cut after spraying, and the design of the spraying fixture is improved. This method not only simplifies the manufacturing process of the fingerprint identification module, but also solves the problem of spraying quality in the original process, and greatly reduces the time consumption in the spraying process. Significantly improves the production efficiency and reduces the number of spraying fixtures used.
(2) Since the low temperature solder paste is weaker in welding strength than the high temperature solder paste used in the original process, there may be great hidden dangers in the reliability of the products using the low temperature solder paste.
(3) Aiming at the problem of poor appearance and assembly gap for fingerprint identification, such as the existence of metal ring and chip gap. By changing part of the fingerprint manufacturing process, that is, the upper cover metal ring and the chip are first combined and then bound to the FPC soft board, the gap problem can be optimized to a certain extent.
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