Regarding the reason about no display on TFT display

If there is no display on TFT display, the possible reasons are:

1) The tft display connection layer is broken, because it is broken during the test or the buckle is damaged, we can prevent this by replacing the buckle regularly. If there is a problem with the buckle during the test, it cannot be used and needs to be repaired immediately.

2) FPC is damaged and torn, which is caused by the operation process. To avoid this, we need the products cannot be overlapped during the operation, and the FPC cannot be taken when taking the product. The FPC is not subject to external forces during the operation.

3) Defective components, during the production process, the components may be injured/burned or the components may fall off. Therefore, we need to protect each product from overlapping and collision, avoid component damage and friction, and bend the FPC into the backlight slot. It is also possible to use the wrong components, check the BOM, and the physical object and samples before production. It is necessary to check whether the first test component is consistent with the BOM sample during SMT placement, and whether the test component is consistent with the drawing sample after the repair welding component is welded

4) FPC hot pressing or IC bonding is bad, which may be hot pressing deviation, hot pressing foreign matter, no particles / few particles / IC bubbles / FPC bubbles / particle aggregation, etc. We can prevent it in the following ways: First, press and hold the make point for alignment when adjusting the machine, confirm the offset of the first piece, and conduct random inspections during the process. Second, clean the press head and platform of the machine every 2 hours, check whether it is OK during the process, and confirm the cleaning effect of the machine (water drop angle). Third, adjust and confirm the flatness of the indenter, measure the temperature of the indenter, and check the cleaning effect of Plasma (water drop angle test). If the ACF is not suitable, it needs to be re-evaluated, and the pressure of the indenter is too large or too small

5) Wrong IC. The specific performance is that the IC is broken and the IC is damaged by static electricity. By not giving any external force to the IC, the damage to the IC is avoided. The specific measures are that the equipment and voltage must be grounded, anti-static tools must be worn for operations, and live operations cannot be performed.

6) The glass is broken, and the glass is broken by external force. The specific measure is to standardize the operation method, and the glass steps cannot be taken to avoid crushing. When assembling the FOG and the backlight, pay attention to the fact that the FOG should be completely turned into the backlight, so as not to fit into the broken glass. When the customer installs the machine, be careful not to press the glass or make the glass localized.

7) Bad ITO, scratched/burned/shorted ITO. Control the depth of the cutting knife, pay attention to the technique of the slivers, and pay attention to placing the ITO upward when cleaning the glass to avoid scratching downwards, do not work with live electricity, pay attention to the technique when repairing, and inspect the circuit after repairing.

8) Didn't power on.