R&A DAILY NEWS 9/4/2024

Samsung and SK Hynix aim to commercialize mobile HBM for smartphones by 2026.

Interest in mobile HBM is growing as smartphones evolve into new Al devices. Mobile HBM is likely to be customized for smartphone manufacturers or smartphone AP developers, signaling a shift from the traditional supplier-centered model to

a demand-driven approach. This is similar to SK Hynix's custom low-power DRAM supply for Apple's Vision Pro headset.

China's chip equipment spending reached $25 billion in the first half of the year.

In the first half of 2024, China's spending on chip manufacturing equipment surged to $25 billion(approximately 177.94 billion RMB),surpassing the combined total of South korea, Taiwan. and the United States. According to SEMl data, China has led the global semiconductor equipment market, becoming the largest revenue source for top global chip equipment suppliers.

Samsung Electronics' DS division reorganizes to tackle fierce competition in advanced semiconductor packaging.

Samsung Electronics'Device Solutions (DS) division recently underwent a significant reorganization and expanded its team to boost competitiveness in semiconductor packaging. This strategic move highlights Samsung's focus on strengthening its packaging capabilities and scaling up for maximum synergy.

Intel is discontinuing its Beast Lake processor line and shifting focus to high-performance GPUs and Al processors.

Intel's strategic shift from the Beast Lake processor line towards high-performance GPUs and Al processors reflect changing market demands ano future technology trends