Pulsed laser deposition

Pulsed laser deposition (PLD) is a physical vapor deposition (PVD) technique where a high-power pulsed laser beam is focused inside a vacuum chamber to strike a target of the material that is to be deposited. This material is vaporized from the target (in a plasma plume) which deposits it as a thin film on a substrate (such as a silicon wafer facing the target). This process can occur in ultra high vacuum or in the presence of a background gas, such as oxygen which is commonly used when depositing oxides to fully oxygenate the deposited films.

The process of PLD can generally be divided into five stages:

• Laser absorption on the target surface
• Laser ablation of the target material and creation of a plasma
• Dynamic of the plasma
• Deposition of the ablation material on the substrate
• Nucleation and growth of the film on the substrate surface
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