The production process of FPC in the flexible board factory

1. Double-sided manufacturing process of flexible PCB factory

Cutting material→drilling→black hole→copper plating→pretreatment→dry film sticking→alignment→exposure→development→pattern electroplating→release film→pretreatment→dry film sticker→alignment→exposure→development→etching→release film →Surface treatment→covering film→pressing→curing→immersion nickel gold→character printing→cutting→electrical testing→punching→final inspection→packaging→shipping

1. The single-panel process of the FPC factory

Cutting material → sticking dry film → aligning → exposure → developing → graphic plating → stripping → surface treatment → covering film → pressing → curing → immersion nickel gold → printing characters → shearing → electrical testing → punching → final inspection → Packing → Shipping

Process details:

Cutting: Cut the copper foil to the appropriate size in the future

Drilling: According to the Layout drawing, use a drill to drill holes on the copper foil

Black hole: Graphite and carbon powder form a conductive film on the hole wall through physical action, and then directly form copper on the hole wall by electroplating

Immersion nickel gold: The increase or decrease of gold plating on the surface of FPC leakage copper is to enhance the conductivity, welding performance and oxidation resistance of FPC, but in order to prevent the gold layer from penetrating into the copper layer, resulting in gold infiltration, it is necessary to first coat the copper surface with a layer of nickel for For isolation, nickel is too thick, high hardness, poor flexibility, too thin, poor strength, easy to fall off.

Flexible PCB questions, contact: [email protected]