Precautions for making HDI circuit boards

When producing High Density Interconnect (HDI) circuit boards, the following factors should be taken into consideration:

1. Design Rules: Pay special attention to design rules when designing HDI circuit boards. HDI circuit boards usually require a higher wire width/space ratio. Therefore, it is necessary to use high-speed transmission media with low dielectric constants (such as PTFE) to meet the higher signal speed requirements.

2. Stacking Rules: Choose the most suitable circuit board characteristics and HDI circuit board stacking arrangement. Compare various options, including traditional four-layer circuit boards, non-copper inner layer boards, and buried capacitor circuit boards.

3.Special Processing Requirements: Pay attention to special processing requirements during the manufacturing process, such as board thickness control, FPC interlayer wiring, chip interconnection, BGA placement, and branch organization.

4.PCB Manufacturer Selection: Please ensure that the selected manufacturer can meet the manufacturing requirements of HDI circuit boards and have sufficient production experience and qualifications. The HDI manufacturing process is very complex, and production requirements are higher than ordinary printed circuit boards, so it is essential to choose a reputable manufacturer with product quality assurance.

5.Quality Control: Pay attention to strict quality control in the HDI circuit board manufacturing process. Advanced inspection equipment such as AOI and X-ray detection should be used during production. In addition, industry standards should be established according to IPC-6012 and MIL standards to ensure the effective operation of the quality control system.

These are the factors to consider when manufacturing HDI circuit boards. By carefully manufacturing circuit boards according to these points, high-quality HDI circuit boards can be produced, ensuring product stability and reliability.