PowerUP Fortronic: Pioneering the Future of Power Electronics, Packaging Techniques, Podcast, USB Type-C, Synchronous Rectification and more!
Maurizio Di Paolo Emilio
Content Editor & Technical Writer | Ph.D in Physics | Power Electronics, Wide Bandgap, Renewable Energy, Embedded Systems, Quantum Computing
Welcome to my newsletter dedicated to power electronics enthusiasts. If you'd like to contribute to it, please don't hesitate to contact me. Today, the newsletter reached more than 13,200 subscribers! Thank you!
The PowerUP Conference & Expo 2024 promises to be a key event for professionals in the power electronics and semiconductor industries. Taking place on September 18, 19, 2024, the conference will offer a series of keynote presentations and panel discussions focused on the latest innovations in GaN and SiC technologies, energy solutions, and market trends.
The event will kick off with a keynote by Alex Lidow, CEO of Efficient Power Conversion (EPC), titled “What a Long, Strange Trip It’s Been.” Lidow, a leading figure in the power semiconductor industry and co-inventor of the HEXFET power MOSFET, will reflect on the evolution of power conversion technologies. His presentation will delve into the transition from silicon-based MOSFETs to gallium nitride (GaN) transistors, highlighting the key lessons learned and the technological advances that have driven this shift. Lidow will also present a roadmap for the future, discussing the similarities and differences in how various applications are moving from silicon to GaN transistors, positioning GaN as a key technology in the obsolescence of traditional silicon MOSFETs.
Following Lidow, Simon Keeton, Group President of the Power Solutions Group at onsemi, will present on “Vertical Integration in Energy: Adapting to Dynamic Market Demands with Comprehensive Solutions.” Keeton, who has held various leadership roles at onsemi, will explore the transformative impacts of Silicon Carbide (SiC) and Silicon IGBT technologies on energy infrastructure and electric vehicles (EVs). He will emphasize the importance of vertical integration in offering comprehensive solutions that optimize efficiency and cost-effectiveness across the energy value chain, from solar solutions and energy storage to EV charging and vehicle electrification. Keeton will argue that as markets evolve rapidly, the ability to provide end-to-end solutions is crucial for meeting dynamic and changing demands, particularly in the automotive and industrial sectors.
The next keynote will be by Vittorio Crisafulli, Director of Automotive Solution Business Development at NXP, who will discuss “Trends and Challenges in the Electrification Market: How Semiconductor Innovation is Evolving to Address Rapidly Changing Dynamics.” Crisafulli, who has a rich background in the semiconductor industry, will address the ongoing transformation of the automotive sector towards electrification, automated driving, and data-driven services. He will highlight the challenges that traditional car manufacturers face in adapting to these changes and how semiconductor innovations are crucial to overcoming these hurdles. Crisafulli will present NXP’s CoreRide platform as a significant advancement in integrating software and hardware to accelerate the adoption of Software Defined Vehicles (SDVs).
Mike Engelhardt, the author of QSPICE? at Qorvo, will follow with a presentation titled “Exploiting Market Inefficiencies with Power Simulation Tools.” Engelhardt, a pioneer in the field of simulation tools, will discuss the business model of providing free simulation tools like LTspice and QSPICE?. His talk will cover how these tools exploit market inefficiencies and contribute to advancements in simulation and power supply design, supporting the wider adoption of innovative semiconductor technologies.
The afternoon will feature an Executive Panel on SiC & GaN Technologies, moderated by Maurizio Di Paolo Emilio, Editor-in-Chief of Power Electronics News. The panel will bring together top industry experts to discuss the latest advancements, challenges, and opportunities in the field of wide-bandgap semiconductors.
Cem Basceri, CEO of QROMIS, will discuss “Empowering GaN Power Electronics with a Scalable GaN-on-QST Manufacturing Platform,” focusing on innovations in GaN technology and the scalability of manufacturing processes.
Gayn Erickson, CEO of Aehr Test Systems, will talk about “Wafer Level Test and Burn-in to Increase Reliability and Reduce Costs in WBG Devices,” emphasizing the importance of testing and reliability in the development of wide-bandgap devices.
Thomas Neyer, SVP of R&D GaN Technology Development at Infineon, will present “It is Prime Time for Wide-Bandgap Technology,” arguing for the readiness and necessity of wide-bandgap technologies in the current market landscape.
Victor Veliadis, Executive Director and CTO of PowerAmerica, will discuss “Strategic Initiatives for Mass SiC Commercialization,” sharing insights on how to drive the widespread adoption of SiC technology through strategic partnerships and innovation.
To conclude the day, Diego Giordani, Director of Assodel (Associazione Distretti Elettronica in Italia), will present “After 40 Years of History: Assodel’s Perspective on Macro Trends.” Giordani, with his extensive experience in the electronics sector, will discuss the importance of market analysis and knowledge sharing within Italy’s electronics supply chain. He will highlight the role of associations like Assodel in fostering community knowledge and supporting industry growth, particularly in the era of AI and digital transformation.
Packaging Techniques for Improved Power Device Performance
By Sonu Daryanani
The need for increased power density can place unique challenges on the power device, packaging, and cooling techniques. High temperatures and temperature swings during power conversion limit the maximum power capability, system performance, and reliability. In this article, we will summarize two different techniques to maximize the thermal performance and power density of power modules and devices.
Wide Bandgap Week Insights – August 30, 2024
By Maurizio Di Paolo Emilio
Here’s a RoundUp of this week’s must-read news about SiC, GaN, and Wide Bandgap Materials!
Universal 85 V to 265 VAC to Dual-Output ±12-VDC to 0.5-A 12-W Flyback Converter Using TNY287
By Hesam Moshiri
The most essential part of any electronic device is the power supply unit. Any instability or malfunction here causes the device to stop or show weird behavior. This article introduces an AC-to-DC flyback switching power supply that converts universal 50-Hz AC input (85V to 265 VAC) to dual-output (positive and negative) 12 VDC to 0.5 A (2*6 W), which can be used in various applications, such as powering dual-supply op amps, amplifiers and function generators.
Ensuring Safety of USB Type-C Ports with Advanced Protection ICs
By Maurizio Di Paolo Emilio
Fortune Advanced Technology Co., Ltd. (FA) is an IC design firm established in 2013 with headquarters in Taiwan. The company’s main focus is research and development and the production of high-voltage mixed-signal power management chips. FA has developed various power products that combine analog and digital technologies. These devices offer customers energy-efficient, high-performing, cost-effective, and fully integrated power management solutions that fulfill market requirements.
领英推荐
How Synchronous Rectification Enhances Power Converter Performance and Efficiency
By Maurizio Di Paolo Emilio
Synchronous Rectification (SR) is a technique in power supply design that replaces traditional diodes with MOSFETs to improve efficiency and performance. Unlike nonsynchronous converters that use Schottky diodes, SR employs MOSFETs in place of diodes, reducing voltage drop and power losses. This is particularly advantageous as MOSFETs have lower on-resistance (RDSON) compared to diodes, leading to higher efficiency and less heat generation. SR enhances thermal performance, power density, and overall system reliability, making it ideal for applications with stringent efficiency and size requirements, such as portable devices.
Wine Down Friday with Renesas’s Pietro Scalia
By Maurizio Di Paolo Emilio
Welcome to Wine Down Friday! Today, we are thrilled to have Pietro Scalia, head of power business development at Renesas Electronics, as our distinguished guest. With a wealth of experience in power systems and a passion for innovation, Pietro dives deep into the transformative world of wide-bandgap semiconductors, discussing the key advantages of GaN and SiC over traditional silicon-based solutions. He shares insights on the latest challenges and breakthroughs in power technology and highlights the evolving landscape of the power semiconductor market, driven by AI and electrification. Outside of work, Pietro enjoys tennis, beach volleyball and playing guitar.
Future-Proofing Semiconductor Talent: Strategies and Insights (Podcast)
By Maurizio Di Paolo Emilio
Jason Dubin, VP of executive search at SBT, is an experienced recruiter with eight years in the semiconductor field who has connected with thousands of engineers. In this podcast, Jason discusses the semiconductor industry’s evolving landscape, focusing on power management integrated circuits, wide-bandgap semiconductors and the critical need for specialized talent. He calls attention to skills for transitioning engineers and the impact of government initiatives on talent development.
Wise-integration establishes a subsidiary to facilitate the development of Asian businesses and promote growth in China
By Maurizio Di Paolo Emilio
To assist Chinese customers in achieving their power-performance/cost objectives and expedite its expanding business in China, Wise-integration, a French pioneer in digital control of gallium nitride (GaN) and GaN integrated circuits (ICs) for power supplies, has announced the establishment of a subsidiary, Wise-integration Ltd., headquartered in Hong Kong.
Panasonic Energy to unveil its latest nickel metal hydrid battery system for railway vehicles at the Innotrans exhibition in Munich in September 2024
By Maurizio Di Paolo Emilio
Panasonic Energy will showcase its pioneering nickel-metal hybrid battery system for railway carriages in Hall 15.1, Booth No. 180, during the InnoTrans 2024 exhibition in Berlin, taking place from September 24 to 27. The new modular Ni-MH battery system is specifically designed to serve as an auxiliary power source for railway vehicles, providing a variety of characteristic qualities that distinguish it from conventional systems.
Finwave Semiconductor and GlobalFoundries Form a Partnership to Develop RF GaN-on-Si Technology for Cellular Handset Applications
By Maurizio Di Paolo Emilio
Finwave Semiconductor, Inc. has struck a key technology development and licensing agreement with GlobalFoundries (GF), a prominent specialized foundry known for its extensive experience in RF (radio frequency) fabrication. The collaboration combines Finwave’s advanced GaN-on-Si technology with GF’s US-based high-volume manufacturing capabilities and extensive RF innovation history, including pioneering RF Silicon-On-Insulator and Silicon-Germanium solutions.
For More Information, please visit the following links:
Chief Marketing and Communications Officer - Technology Evangelist
6 个月Thanks Maurizio for this summary and looking forward to meet you at PowerUP & Fortronic. ??