Poor BGA Soldering

In the SMT (Surface Mount Technology) process, BGA (Ball Grid Array) soldering defects commonly include the following:

1、Solder Bridging (Short Circuit) , also known as short-circuiting, occurs when solder balls short-circuit during the soldering process, causing two pads to connect and form a short circuit. The defect illustration is shown below:

2、Fake soldering (Head-in-Pillow, HIP), commonly referred to as "Head-in-Pillow (HIP)," occurs when the solder joint appears sunken in the middle, resembling a pillow. Common causes include oxidation of the solder balls or pads, insufficient oven temperature, PCB warping, and poor solder paste activity. The HIP illustration is shown below:

3、Voids (Air Bubbles) Voids, or air bubbles, are not absolute defects but can degrade soldering quality if too large. They are typically caused by entrapped air in the vias during soldering. The general acceptable void size should not exceed 20% of the ball volume. The void illustration is shown below

4、Cold soldering occurs when the reflow temperature is abnormal, causing the solder paste to not fully melt. This may be due to the solder paste not reaching its melting point or insufficient time in the reflow zone. The cold solder illustration is shown below:

5、Contamination of the pads or residual foreign substances can lead to poor soldering. This may be due to inadequate environmental protection during production. The contamination illustration is shown below:

6、Misalignment occurs when BGA solder balls are not properly aligned with the PCB pads, resulting in poor soldering. The misalignment illustration is shown below:

In conclusion, ensuring high-quality BGA soldering in SMT processes is crucial for product reliability. By addressing common issues such as solder bridging, cold joints, voids, cold solder, contamination, and misalignment, we can significantly enhance the performance and longevity of electronic components. At ABP, our advanced techniques and stringent quality controls are designed to tackle these challenges effectively. Welcome to visit us .#PCBManufacturing#PCBAssembly#ElectronicsManufacturing#BoxBuilding