Polyimide for FPC

Polyimide Adhesives In FPC, currently available polyimide films are used as substrate films, and as adhesives, various types of polyimide adhesives have been successfully developed. Among them, linear thermoplastic polyimide is the mainstream.

Corresponding to the use of flexible circuit boards, Tg should generally be controlled at around 150-250 °C, which has become the key point in molecular design. In order to achieve this, aromatic rings are basically used on the main chain, but functional groups such as meta-position long-chain ethers, carbonyl groups, and siloxanes are tried to be introduced. The introduction of aliphatic groups such as ethylene is easier to control Tg, but it has the disadvantage of short-term thermal tolerance. The demand for flexible boards using polyimide adhesives is expected to grow significantly in the future, but the current situation still requires lamination with copper foil at high temperature and high pressure. It can be said that the improvement of processing technology is the biggest issue. Maintaining the balance of Tg control and heat resistance, and improving the processability, fierce competition is taking place among major companies.

The cast coating type polyimide type copper clad laminate is a completely different manufacturing method from the above-mentioned method of using the polyimide film as the base material. This method is obtained by applying a polyimide resin or a precursor polyamic acid solution on a copper foil and drying it to form a polyimide film on the copper foil. It is produced by coating copper foil with unique polyimide resin and special manufacturing method, drying and curing.

Polyimide materials used in various industrial fields are mainly used for FPC as thin film materials. Other uses of polyimide include TAB (TapeAutomatedBoading) use. In addition, due to the radiation resistance, heat resistance and cold resistance of the polyimide film, it can be used as a protective film for space satellites, etc., and has actually been used in various fields.

In the future, polyimide materials can still expand their application fields more widely according to their unique properties, such as insulation, heat and cold resistance, and electrical reliability. Scientific and technological workers should pay close attention to the needs of the market, and continuously improve the comprehensive properties of polyimide materials to meet the development needs of the industry led by the electronics field.

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