Penetration rate of ALSIC in the IGBT base plate application has increased rapidly

Due to its unique advantages, the penetration rate of ALSIC in the IGBT base plate application has increased rapidly:

#PowerSubstrates & #IGBT Bases/ #IGBTmodulebaseplate， #FlipChip Microprocessor Lids,#Microwave and Optoelectronic Housings,High Brightness LED Applications,#Electronic packaging,#Automobile industry?, etc

1) #ALSIC has high thermal conductivity (170 ~ 200W/mk), which is ten times that of general packaging materials. It can timely emit the heat generated by the chip to improve the reliability and stability of the entire component.

2) ALSIC is a composite material, and its thermal expansion coefficient and other performance can be adjusted by changing its composition. Good matching can prevent fatigue failure, and even install the power chip directly on the ALSIC bottom plate.

3) ALSIC is very light, only 1/3 of the copper materials, which is similar to aluminum, but the bending strength is as good as steel. This makes it perform well in terms of seismic performance, exceeding the copper bottom plate.

4) Alsic's ratio is the highest among all electronic materials, 3 times the aluminum, 5 times the W-CU and Kovar, 25 times the copper. In addition The preferred materials under the fields of aerospace and automobiles are large.

5) Alsic can be processed in large quantities, but the processing process depends on the content of silicon carbide. It can be processed with electric sparks, diamonds, laser, etc.

6) Alsic can be nickel -plated, gold, tin, etc., and anode oxidation can also be performed on the surface.

7) Metal -based ceramic substrates can be welded to the plated Alsic bottom plate. With adhesives and resin, the printed circuit board can be bonded with Alsic.

8) Alsic itself has good gas tightness. However, the air tightness after the metal or ceramic electron packaging depends on the appropriate coating and welding.

9) Alsic's physical properties and mechanical properties are all the same.