PCBA smt assembly processing in a very important procedure

As we all know, DIP processing is a very important process in PCBA chip processing, Assembly quality directly affects the functional properties of the PCBA board, so it is necessary to pay more attention to the DIP?process. DIP?pre-preparation work is more, the basic process is the first electronic components for processing, the staff according to the BOM bill of materials to receive materials, check the material type The basic process is to first process the electronic components, staff receive materials according to the BOM bill of materials, check the material type, whether the specifications are correct, according to the PCBA sample board for pre-processing before production, the steps are to use a variety of related equipment (automatic capacitor foot shear machine, jumper bending machine, diode automatic forming machine, automatic belt forming machine and other molding equipment).

DIP processing requires attention to the following points.

1, before DIP, need to check whether the surface of electronic components with oil, paint and other unclean objects.

2, in the DIP process, must protect the electronic components and PCB flat paste, after the completion of the plug-in need to protect the electronic components is flush state, do not be uneven, while protecting the plug-in after welding pins can not block the pad.

3, if the electronic components on the direction indicator table, you need to follow the correct direction of the plug-in, do not random plug-in.

4, in the plug-in, you need to pay attention to the force of the plug-in, do not insert too much force, resulting in component damage or PCB board damage.

5, when inserting electronic components do not insert the edge of the PCB board, pay special attention to the height of the electronic components and the spacing between the electronic components.

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