PCB Stack-up

To control the manufacturing and signal quality of PCB, here are some general rules for PCB stack-up design:

1. Use symmetrical layer structure for PCB physical warpage control, i.e. the same material and thickness for the symmetrical layer

2. Power plane should be adjacent to the corresponding ground plane to reduce power PDN impedance.

3. A better way to reduce potential cross-talk between two adjacent signal layers is to separate the layers with a ground plane layer between them. Not only will the ground plane increase the distance between the two signal layers, it will also provide the required return path for the signal layers.