PCB high speed board more than 4 layers of circuit board experience
AKEN Cheung 封装基板制造商
Director . Advanced packaging IC substrate manufacturer. Advantages: Cost reduction with realiability. FCBGA/ FCCSP/ CSP/ SiP/ Module/ BGA memory DDR3/DDR4/DDR5/ mmwave/ Embedded/ PCB substrate, uHDI PCB etc. mSAP
because of kdpcb has lot of high density pcb manufacture experience,so lot of customers never worry about the quality problem.now we share some experience:
1, 3 points above the line, try to make the line passes through each point, easy to test, is as short as possible.
2, between the pin as far as possible not to put the line, especially between the integrated circuit pin and around.
3, between different layers of the line as far as possible, in order to avoid the formation of the actual capacitance.
4, wiring as far as possible is a straight line, or 45 degree line, to avoid electromagnetic radiation.
5, ground, power line at least 10-15mil above (the logic circuit).
6, try to make the floor polyline together, increase the grounding area. Line between the lines as far as possible.
7, pay attention to the uniform components, in order to install, plug, welding operation. Text emissions in the current character layer, a reasonable position, pay attention to the direction, to avoid being blocked, easy to produce.
8, the components of the structure, the multiple considerations, the patch element has the positive and negative electrode should be in the package and finally, to avoid the space conflict.
9, the current printed board can be used as a 4 - 5MIL wiring, but usually for 6mil line width, 8mil line distance, 12/20mil pad. The influence of the wiring should be considered.
10, functional blocks as far as possible to put together, zebra and other nearby LCD components can not be too close.
11, to spread the green hole (set to double negative value).
12, it is better not to put battery seat pad, etc, and the reasonable size VIL PAD.
13, after the completion of the wiring to carefully check every link (including NETLABLE) is really connected to the (available lighting method).
14, oscillation circuit components as far as possible * near IC, the oscillation circuit as far away from the antenna and other vulnerable areas. To put the ground pad crystal.
15, consider the reinforcement, hollowed out put elements in a variety of ways, to avoid excessive radiation source.
any others concerns:AKEN
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