COB, which stands for "Chips On Board," is a cutting-edge technology designed to address the heat dissipation issues of LEDs. Compared to through-hole and SMD technologies, COB offers a more space-efficient solution, streamlined packaging process, and superior thermal management.
Advantages of COB Packaging:
- Ultra-Slim Design: COB can be applied to PCBs with a thickness ranging from 0.4-1.2mm, reducing weight to one-third of the conventional standard and significantly saving on transportation and engineering costs.
- Impact and Pressure Resistance: COB products encapsulate the LED chips directly into the concave light positions on the PCB, followed by encapsulation and curing with epoxy resin. The light points form a convex spherical surface that is smooth and hard, making them resistant to impact and wear.
- Wide Viewing Angle: Utilizing a shallow well spherical light emission, COB offers a viewing angle greater than 175 degrees, approaching 180 degrees, providing excellent optical diffusion and soft light effects.
- Flexibility: A unique feature of COB packaging, the bending of the PCB does not damage the encapsulated LED chips. This allows for the creation of LED curved screens, circular screens, and wavy screens with seamless stitching. The structure is simple, and the cost is significantly lower than that of flexible circuit boards and traditional display modules used for making LED screens with unique shapes.
- Strong Heat Dissipation: COB products encapsulate the lights on the PCB board, using the copper foil on the PCB to quickly dissipate the heat from the light core. The thickness of the PCB's copper foil has strict process requirements, and with gold plating, it almost eliminates severe light decay. This results in fewer dead lights and greatly extends the lifespan.
- All-Weather Durability: With triple protection treatment, COB products are waterproof, moisture-proof, corrosion-resistant, dust-proof, and offer excellent static and oxidation resistance, as well as UV protection. They are suitable for all-weather conditions and can operate normally in temperature ranges from -30°C to +80°C.
Working Principle: COB involves adhering bare chips to the interconnection substrate using conductive or non-conductive adhesive, followed by wire bonding to achieve electrical connections.
