Package Advancements, Flyback AC to DC Converter, Low-voltage MOSFETs, Wine Down Friday
Package Advancements Improve SiC Power Module Performance and Reliability
The use of wide-bandgap materials such as silicon carbide and gallium nitride enables efficiency, power density, and reliability advantages in power conversion, but their full potential can be realized only through packaging improvements. In this article, we summarize improvements in SiC power module packaging by two leading SiC device manufacturers.
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Wine Down Friday with Aehr Test Systems’ Gayn Erickson
Today, we’re joined by Gayn Erickson, CEO of Aehr Test Systems, a leader in semiconductor reliability and burn-in testing. With a rich career spanning companies such as HP, Agilent, and Verigy, Gayn has deep expertise in test and measurement solutions for power and AI semiconductors.