OPEN STANDARD MODULE OSM

NEW STANDARD OSM (Open Standard Module) 1.1 Specification released.

There is a new kid in the block called OSM. It is brand new standard for embedded computing provided by standardization organization SGET. It is going to be available in 4-different sizes 0, S, M and L. The idea was to create new future proof standard with and soldered LGA -package which can be surface mounted and tested with a machine. It is having full soft and hard connectivity for ARM and x86 -based CPU’s and is offering wide variety of performance classes for embedded and IoT -computing. Standard products will be offered and supported from the industry leaders in embedded computing like Avnet Embedded (MSC), Kontron, Congatec etc. Most likely we will see lot of other companies joining in later stage.

Why new standard?

We all know well the previous standards like Q7 and smarc, so one could ask where we need a new standard? Main reason is the space. Many of the new IoT devices are with small footprint (0-size 30mm x 15mm) and therefore there is no space for connector and example smarc -module (80mm x 50mm). The other thing is that new OSM can be produced and tested in one production for the whole PCB. Sometimes the number of I/O’s can be extensive and for those cases example L-size can offer up to 662 pins when in smarc you have 314 pins. Some people are as well having some doubts about the smarc -connector reliability in harsh conditions (we have not found that to be a problem). OSM Is obviously giving some advantages for new CPU -platforms and extending the application space where computing modules can be used. OSM is offering smarc -standard benefits in small formfactor and some cases with slightly lower cost as the connector is removed.

What could be the typical applications OSM -could be used in future?

Any IoT device where there are space constraints and still the micro controller is not enough powerful for the application. Any UI -related embedded product where rich and excellent customer experience is needed. Products with higher volume where product differentiation is needed between models. Products in very rough conditions where heat needs to be transferred to chassis and maybe conformal coating is needed for PCB. Mobile devices with limited space and great connectivity and display interfacing needed. Generally, products where a lot of computing power is needed in small space.

What are the benefits of the standard?

OSM is an open standard and is enabling everybody to innovate around this standard. As mentioned, it will be provided and supported by multiple vendors. It will free company resources for the hard CPU -environment development to more productive application development. It is enabling software development in a standard platform and freeing the hard software adaptation work. The upkeep and is staying in minimum level as most of the work is done by the vendor. It will speed up development and enable innovation faster than ever. It is freeing customers from vendor lock and offer truly scalable and multisource product which is an important lesson we have learned during this hard allocation.

?What is coming next?

Vendor development departments are currently doing hard work to realize the first standard products for markets. There are already some products named OSM which are not following the standard so be aware about that. The first engineering samples will be ready before end of this calendar year. They will be based on imx8 -family products and are going to offer great scalability in price and performance. To start with the modules, they will be offered in smarc -board with connector. This will enable the quick start for evaluation and software development. Customer can as well start development with smarc or in virtual environment to speed up the software development. Family of CPU’s will expand in the future rapidly and we will see a lot of exiting new CPU’s arriving in this module standard.