Online meeting Optica
February 25th 2025 I will give an elevator pitch at the Optica online industry meeting entitled "PIC packaging for volume production".
I will present the Low-Cost, Air-Cavity Package for?Photonics Integrated Circuits (PICs) utilizing existing air-cavity (ACP) RF power package solutions with LCP injection molding technology from RJR Technologies (RJR Technologies, Inc.).
See also my previous post:
If you have questions or requests, please contact me: