The Occam Files No. 11

“Occamnomics”

 For first-time readers, the Occam Process was conceived on the heels of the EU’s mandate that lead be eliminated from electronics. Since introduction of lead-free solder, the electronics industry has arguably wasted well over $100 billion to solve what scientific analysis has shown to be a non-problem. The concern over human and environmental injury from electronic waste was in the final analysis really a matter of mismanagement of the process. The tin-lead solder alloy is, in the opinion of most electronic assembly experts, superior in almost every way to the myriad of disparate lead-free alloys that have flooded and arguably confused the EMS industry with a mind-numbing array of choices.

This insanity was the inspiration of what some have called another insanity, the elimination of solder from the electronics manufacturing process. The Occam Process’ foundation is predicated on the following few and simple words of philosopher-monk William of Occam (1287 – 1347): “It is vanity to do with more that which can be done with less.”

The Occam Objective

Is it possible to eliminate solder from electronics? Yes. Is it cost effective to eliminate solder from electronics and might one save a lot of money? Yes. Would it be difficult to eliminate solder from electronics assembly? Definitely! The often staggering costs of retooling, retraining, restaffing & down time have turned many manufacturing & operations managers into reactionaries who abhor change. Change is the enemy, and change is typically only effected by either mandate, high-level managerial or legislative actions (the EU’s mandate is a very good example of the latter), by fear of loss of position in the market (in the present case, a product of the EU lead-free mandate couple with managerial fears of being frozen out) or in less frequent occasions, when an opportunity is seen by upstarts to effect competitive change to make better, more appealing, less costly or more useful products for either existing or prospective markets.

This is the here-argued prospective appeal of the Occam Process because it is believed that it can deliver on all the aforementioned objectives?and more. (Many other benefits are outlined in “Solderless Assembly For Electronics –The SAFE Approach,” a free book which details more of what will only be touched on here.)

The Savings: A Brief Analysis

Perhaps the most attractive element of the Occam Process it its prospective ability to save the global electronics industry perhaps as much as $100 billion per year. Not possible, or too much you might think? Consider this back of the napkin analysis. The reader is invited to do their own estimations.

Premise: An Occam/SAFE assembly is a reversal of normal manufacturing, that is, the manufacturer creates a “component board” where components (all ICs tested and burned in to assure reliability) are accurately fixed in place on an inexpensive, dimensionally stable, thermal spreading substrate (e.g., aluminum) with their terminations facing up. In the ideal case, all components have terminations which share a common pitch (e.g., 0.50 mm is most attractive but other pitches are possible so long as all components of the assembly share the same pitch), a common thickness and all terminations a copper finish and terminations (i.e., lands) are of common dimensions. The “component board” is then treated as a base-level build-up board with layers of insulation and circuits (normally many fewer) additively built up to the board making all required interconnections. Testing and rework are deemed anathema to the Occam Process concept because they add no value but simply increase cost and waste time. Better to first do the right things and then do all those things right…

That’s it in a nut shell.     

What’s missing from the aforementioned processing sequence? All of the steps associated with the soldering process.

Steps, Steps, and More Steps

Consider for a moment the number of steps and how many competing “solutions” exist today. Look at any magazine on electronics manufacturing and check out the articles and advertisements for solder finishes for PCB, new substrates that will stand up to high-temperature, lead-free solder alloy requirements, various solder alloys, different solder fluxes, clean and no clean, solder and component placement inspection systems (both before and after the process), the equipment required to effect the soldering process, reflow, wave, laser, vapor phase, cleaning equipment and chemistry to remove flux residue, solder rework tools and repair solutions, and detection of new failure mechanisms both on the PCB and in the solder joints themselves (soldering is an imperfect process with myriad potential problems). 

Consider also that these processes require floor space and energy and a lot of skilled people are required to operate and maintain them, as well as those charged with inspecting and testing the assemblies at various stages along the way. These are also expenses.

What does that all tally up to on a global basis? What is the value of the global electronics manufacturing services industry market?

Compare that value with the prospective one for Occam/SAFE manufacturing, which has many fewer manufacturing steps and less materials; should it be more? The same? Or less?

How much might one save on electronic assembly? (exclusive of component costs which are fixed except that they might be made cheaper by eliminating the need for a solderable finish) Could one save 5%? 10%? 15%?... even 30%?

Do your own math. In your analysis be sure to keep in mind that the Occam/SAFE completed sub-assembly offers a significant reduction in the size of the product envelope, owing to the incorporation of fine common-denominator pitch components which can be closer spaced than solder mounted SMT components (Look at the earlier LinkedIn post showing the Occam Advantage based on the demonstration provided by Darren Smith, of Athenatech.) 

 “Occamnomics” is obviously coined for this particular article, but the term has prospective use beyond the scope of electronics manufacturing if the readers mind will allow. Simpler is arguably always better. Einstein said it very succinctly when he opined, “Things should be made as simple as possible and not simpler.” The great man demonstrated it as well with the brevity of those well-crafted words. His suggestion has been followed in the conceptualization and development of the Occam Process. Those are wise and timeless words for all of us to consider in everything we do…

Next time: CAD software for Occam… what are the requirements?