NXP, Excelfore and Tessolve Unleash the Potential of Vehicle Connectivity

NXP, Excelfore and Tessolve Unleash the Potential of Vehicle Connectivity

The quest for seamless automotive connectivity while maintaining and managing a steady data flow is becoming a critical challenge in the fast-evolving landscape of Software-Defined Vehicles (SDV) — transforming how the automotive industry acquires and leverages insights using analytics and machine learning.

OEMs require tools to keep pace with the ongoing transformation, unleashing the potential of vehicle connectivity for over-the-air (OTA) software updates and data collection to enhance the driver experience and enable monetization.

NXP Semiconductors joined forces with Excelfore and Tessolve? to tackle the challenge by developing an innovative idea for AUTOSAR and non-AUTOSAR applications: integrating Excelfore's SDVconnect framework, Tessolve's TERA platform and the S32G-based system solution. They aimed to merge SDVconnect's cloud-to-vehicle connectivity solutions and cloud-based device management applications with TERA's sensor-to-cloud connectivity plus CAN and Ethernet, together with storage capabilities.

A Solution for Vehicle OTA Updates

On the one hand, SDVconnect offers secure standards-based and cloud-to-edge device management plus comprehensive edge-to-cloud connectivity solutions. It leveraged Excelfore’s experience pioneering high-performance managed Ethernet connectivity at the automotive edge.

On the other hand, the TERA application service-oriented gateways for data to real-time predictions at scale bridge the connection between vehicle data and the cloud via 4G/5G interfaces, taking advantage of Tessolve's engineering expertise and end-to-end innovation.

Before this partnership, Excelfore's SDVconnect software faced the hurdle of finding a hardware computing platform and network switches in a single cohesive solution. Tessolve's TERA platform addressed this gap with a comprehensive system platform providing compute, storage, network and connectivity solutions connecting CAN data to the cloud. NXP S32G2/G3 silicon capabilities powered the solution and supported a robust system solution for the new vehicle E/E architecture.

Collaboration Is the Key in New Vehicle Architectures

The in vehicle-to-cloud collaboration fully integrates the Excelfore eSync OTA and the eDatX data aggregation solutions. In addition, the TERA system platform now integrates with the AWS IoT Greengrass, open source edge runtime and cloud service, helping build, deploy and manage intelligent device software.

The collaboration has generated rapid development and integration with manufacturers using the available NXP software development kits (SDKs) for swift evaluation and deployment, leading to faster customer deployment and notable wins.

NXP, Excelfore and Tessolve are poised to provide scalable solutions for various segments, addressing challenges and enhancing customer value. The partnership's success is a testament to the transformative power of collaboration in automotive technology. They are unleashing the potential of vehicle connectivity.

About Excelfore SDVConnect

Excelfore is headquartered in the Silicon Valley, and has offices in Shanghai, Frankfurt, Tokyo and Bangalore. Excelfore customers include the top tier global OEMs and suppliers in the automotive industry and its solutions are driving millions of vehicles globally. Excelfore’s SDVconnect suite of products are accelerating vehicle data services by unifying edge systems with the Cloud. Excelfore’s innovative solutions include the eSync OTA, eDatX data aggregation, eLearn analytics platforms and in-vehicle networking protocol stacks. The eSync OTA platform is based on the eSync Alliance standard, which enables connected cars, electric vehicles and autonomous vehicles.

About Tessolve

Tessolve is a leading System productization and Silicon engineering solution provider, operating in 21 countries across the US, Europe and APAC regions with in-house infrastructure and world-class lab facilities with a global Engineering strength of 3000 engineers.

Tessolve offers product development from concept to manufacturing as an ODM, focused on automotive, Industrial and Avionics market segments accelerating time to market through ready-to-use System on Modules and Application System Solutions, through deep domain expertise, innovative ideas, process-oriented approach, established eco-system partnerships, including supply chain and post-production life-cycle management.

Tessolve offers path-breaking automotive platform TERA as a white labelled product family. TERA includes service-oriented high-performance gateways, TCU, Zonal and Domain controller platforms, OBD Dongle and enhances software-defined vehicle architecture providing a unique customer experience along with FOTA services from their partner Excelfore.

TERA is based on NXP’s S32G vehicle networking processor with edge compute capabilities.

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