Nothing is Impossible... During Assembly Testing!
Patrick Hopper
#ew25 Publisher, President #Influencer @ OpenSystems Media | Embedded | AI | IoT | Military | Aerospace | Embedded World Media Partner #ew25 #embeddedworld
The latest requirements are constantly challenging test engineers with new tasks.
The increased use of highly integrated electronic circuits is presenting new challenges for test engineers in manufacturing. Miniaturization often limits the number of applicable test methodologies. Test systems proven over several decades, such as in-circuit test (ICT) or flying-probe test, are reaching their limits because it is no longer possible to contact all the points needed for good coverage. Read more.
Axiomtek’s CEM561 COM Express? Type 6 Module with 13th Gen Intel? Core?
Axiomtek’s CEM561 in Action
The CEM561 COM Express? Type 6 module from Axiomtek includes the dual channel DDR4-3200 SO-DIMM memory configuration with up to 64GB of high-speed memory, with an optional NVMe SSD for up to 512GB capacity enabling enhanced data access and transfer speeds. Additionally, the module supports two SATA 3.0 ports for storage and built-in TPM 2.0 for hardware security authentication. Read more.
Edge Impulse Enables Visual Anomaly Detection on any Edge Device
Edge Impulse announced an innovation enabling visual anomaly detection on any edge device, from NVIDIA GPUs to Arm MCUs, through the first model architecture of its kind,?FOMO-AD?(Faster Objects, More Objects - Anomaly Detection). To enhance the productivity of visual inspection systems, the scalable FOMO-AD can train models to identify and index anything outside set criteria as an anomaly in video and image data. Read more.
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