Nexperia now offers space-saving CFP3-HP automotive planar Schottky diodes

【Lansheng Technology News】Nexperia recently announced that it now offers a portfolio of 22 new planar Schottky diodes in CFP3-HP packages. The product portfolio includes 11 industrial products as well as 11 AEC-Q101 compliant products. This product launch is to support the trend of manufacturers replacing SMx-type packaged devices with smaller CFP packaged devices, especially in automotive applications. These diodes are suitable for DC-DC conversion, freewheeling, reverse polarity protection and OR-ing (hiccup) applications.

To maximize design flexibility, device options in the portfolio offer reverse voltage VR(max) from 30 V to 100 V and forward current IF(average) from 1 A to 3 A. A unique feature of the CFP3-HP is the use of an exposed heat sink, thus providing an extremely high level of thermal efficiency (Ptot) in this package size (3.7 mm x 1.8 mm x 0.9 mm).

These packages utilize a proprietary copper clip design to address challenging design requirements for efficiency and space savings. Today, CFP packaging is available for different power diode technologies, for example, Nexperia’s Schottky rectifier diodes and fast recovery rectifier diodes, but can also be extended to bipolar triodes. This significantly enriches product diversity and further solidifies Nexperia’s position as a leader in packaging innovation. A wider selection of devices can be provided to customers through semiconductor manufacturers with trusted supply chains.

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