New White Paper: ADLINK Harnesses the Arm SystemReady-Compliant Ampere?? Altra?? Module, Pushing COM-HPC to New Heights
Patrick Hopper
Publisher, President #Influencer @ OpenSystems Media | Embedded | AI | IoT | Military | Aerospace
COM-HPC is a relatively new computer-on-module (COM) standard for high-performance embedded computing. Officially released in 2021, the standard was developed by representatives from congatec, Kontron, and ADLINK Technology under the auspices of PICMG. COM-HPC promises higher performance than the previous standards it was based on, in addition to an increased number of interfaces, multiple modules sizes, and different configurations, including options for both client- and server-type modules.
Qeexo and Bosch Enable Developers to Build and Deploy Machine-Learning Algorithms to Bosch AI-Enabled Sensors
Qeexo,?developer of the Qeexo AutoML, and?Bosch Sensortec GmbH announced that machine learning algorithms created using Qeexo’s AutoML can now be deployed on Arduino Nicla Sense ME with Bosch BHI260AP and BME688 sensors.