My first 100 days at Philips Micro Devices, and its crucial role in bringing innovations in PCBA and micro-assembly to life

The ‘first one hundred days’ in a job are said to be crucial to get up-to-speed in your work, get to know your colleagues and work process, and of course to develop your own plan and way forward. Having been with Philips Micro Devices for almost a hundred days now, I’d like to share some reflections and first thoughts with you.

I wasn’t new to Philips, having worked for the organization over a decade ago. Never, however, did I realize the crucial and pivotal role that the Micro Devices Facility (often called ‘The Greenhouse’) plays in high-tech innovation.

Together with MEMS Foundry, Micro Devices has become an indispensable part of Philips Innovation & Strategy. Why? Because this is where innovation actually comes to life. At the Micro Devices Facility, we enable our customers to execute their New Product Introduction (NPI) process smooth and according to project plan. 

Here, we contribute to the innovation of Philips and our top-notch external customers with their complex PCBA and micro assembly needs in the Brainport region and beyond. We do this by:

1. Keeping short and structured line of communication 
2. Living up to our delivery commitments
3. Offering high quality service 

We are located at center of innovation playground MicroLab (Strijp-S, Eindhoven), where historically countless Philips innovations took place. 

Summary of our competences and expertise:

• Micro Devices (Greenhouse) is part of Philips Innovation & Strategy, for decades enabling high-tech innovations in, several areas, including micro devices, semiconductors, photonics, RF/Microwave, mmW and high-tech machinery
• Serve vast number of large multi-nationals and start-up customers.
• Skilled and competent experts and specialist to support various applications
• Competences in complex PCBA and micro assembly, including component placement, highly complex interconnects and photonic assembly
• Various soldering techniques to enable SMT, small pitches down to 200 μm and smallest passives 008004 (0,250 mm x 0,125 mm) to enable miniaturization
• Various carriers, including conventional, non-standard and next gen semiconductor-based carriers
• Spray/Parylene coating, corrosive and mechanical protection of wire bonds & flip-chip interconnects
• Wide range of test competences: Structural Tests (3D paste inspection, 3D Automated Optical Inspection/3D AOI, In-Circuit Testing/ICT, Flying Probe, 3D X-Ray, Boundary Scan Testing/BST, Functional testing), High voltage test/Stress Test/Burn-In Test, Programming, Cleaning Facility and Module Assembly

Want to know what we can do for you? Please reach out to us for your PCBA and micro-assembly related inquiries!