Module Tech 01 | Laser Non-Destructive Scribing Technology

Module Tech 01 | Laser Non-Destructive Scribing Technology

In the manufacturing of high-efficiency photovoltaic modules, Gstar consistently adheres to cutting-edge technology to ensure product quality. This article will focus on laser non-destructive scribing technology and explore how this process helps Gstar achieve higher quality modules.


Principle of Laser Non-Destructive Scribing Technology

Laser non-destructive scribing technology, also known as Thermal Laser Separation, is based on the thermal effects caused by localized laser irradiation. When the laser is applied to the cell, it generates local temperature differences, forming a temperature gradient field. The highest temperature occurs at the laser spot, creating compressive stress, while the surrounding areas are under tensile stress. Since the compressive strength of brittle materials greatly exceeds their tensile strength, when the tensile stress reaches the fracture strength, the solar cell will crack along the path of the laser movement, and the crack will propagate smoothly to achieve precise cutting.


Process Overview

After pre-setting an induced groove of a certain length at both ends of the cell, the thermal effect of the laser guides the crack to propagate along the predetermined path, allowing for a scribing operation in one time. This process is widely used in the mainstream cell cutting fields, including HJT, PERC, TOPCon, and IBC, demonstrating its broad applicability.


Technical Advantages

1 Cross-Section Morphology

Traditional laser scribing processes create wider and deeper cut paths on the surface of the cell, with significant heat-affected zones leading to thermal damage in about half of the cross-section. In contrast, the non-destructive laser scribing technology avoids high-temperature ablation, ensuring that the cross-section of the cell is smooth and clean, without any damage points.


2 Processing Dust

Traditional laser scribing processes generate a large amount of silicon dust when removing material from the cut path, requiring specially designed dust removal devices to prevent fire hazards. The non-destructive laser scribing process, however, generates almost no dust, having a negligible environmental impact.


3 Processing Temperature

The processing temperature of the non-destructive laser scribing technology is controlled between 150-250°C, which falls within the low-temperature process category, making it more energy-efficient and environmentally friendly.


Technological Innovation Leading the Future

After introducing non-destructive cutting technology into the Gstar module production line, the use of low-temperature laser processes and the natural separation of materials through thermal stress have resulted in cut cells with smooth, burr-free cross-sections, free from laser damage and heat-affected zones. This innovative process significantly enhances the yield and quality of module products, improving efficiency by approximately 0.1-0.3% compared to traditional destructive cutting. This represents not only a technological breakthrough but also a commitment to pursuing high-quality products.

As a leader in global integrated supply chain solutions, G-STAR Group consistently keeps pace with cutting-edge technologies to drive innovation in photovoltaic module manufacturing and system services. We are dedicated to applying the latest technological achievements to production, enhancing the efficiency and performance of photovoltaic products, and providing high-quality services. At the same time, G-STAR Group is eager to share professional knowledge with industry peers, learn together, and contribute to the prosperous development of the photovoltaic industry, injecting continuous momentum into the widespread application of green energy and sustainable development globally.


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