Mini LED Solder Paste

Mini LED Solder Paste

Mini LED Solder Paste

As a leading supplier in the traditional solder market, Jufeng has been continuously innovating in the field of electronic packaging for the past 16 years.??Today, with the innovation of Mini LED packaging technology, Jufeng is?providing ultra-fine solder paste solutions?for different process application routes.

With the continuous upgrading of domestic Mini LED industry, the market trend is gradually clear.??The consumer electronics market, backlit TVs?and notebook computer display applications are growing steadily;?Small size VR display technology innovation;??and the need for intelligent new energy vehicles is also continuing to promote the progress of on-board display technology.??In the process of application and development of the above technology, Mini LED packaging technology plays an indispensable role.?

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Image?1 Gaming Screen

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Image?2 Laptop

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Image?3 Antomotive Display

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Image?4 outdoor commercial display

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·?Image?5 TV (High brightness & high refresh rate

?&Local?Dimming)

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·Image?6 VR?Glasses?(High brightness & high refresh rate)

As the size of Mini LED chip gets smaller and smaller, the packaging process has higher and higher requirements for solder.??Jufeng's Mini LED solder paste solution, JF-ML100, is designed to provide better performance while ensuring higher reliability?????????

JF-ML100 is a lead-free die attach?solder paste suitable for Mini LED printing process.?Using unique flux formulation technology with ultra-fine solder powder , with a wide process window and excellent product stability,?it has?good performance?in different application scenarios

Feature:

High sphericity & concentrated particle size?distribution Solder Powder

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Image?8 solder powder

  • Stencil printing life(>10h)
  • Excellent void performance after reflow
  • Transparent& Less flux residue
  • Wider process window
  • High shear strength after solderin

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Image?9 JF-ML100?Plot of viscosity change

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