MID Prototyping with Direct 3D Printing of LDS Materials
HARTING 3D-Circuits

MID Prototyping with Direct 3D Printing of LDS Materials

Overcoming Challenges in Traditional MID Prototyping

Previously, 3D printing for 3D-MID prototypes presented limitations in resolution and material compatibility. FFF/FDM methods, while offering affordability, suffered from poor surface quality. Conversely, SLA/DLP/SLS printing, known for better resolution, required additional manual coating steps and lacked precise layer thickness control.

The groundbreaking solution from HARTING and Cubicure addresses these challenges head-on. By leveraging Cubicure's Caligma? Hot Lithography system, this technology enables direct 3D printing of LDS materials with exceptional resolution (18μm) and smooth surfaces. The printed material integrates seamlessly into the existing MID process at HARTING, resulting in significant time savings for prototype development.

Key Advantages for Streamlined Development

  • Superior Resolution and Surface Quality: Achieve highly detailed features and smooth surfaces for improved functionality of your 3D-MID components.
  • Direct 3D-Circuits Integration: Eliminate the need for manual coating steps, streamlining the entire prototype development process. This translates to faster turnaround times and reduced costs.
  • Solderable Material: Printed LDS components integrate seamlessly with existing metallization processes within the MID workflow.
  • Unmatched Speed and Flexibility: Rapidly iterate on designs and explore new geometries with unprecedented ease. This allows for quicker exploration of design possibilities and faster optimization of your product.

A Collaborative Journey Towards Innovation

The partnership between HARTING and Cubicure began in 2019, fueled by a shared vision of integrating LDS technology into additive manufacturing. After years of collaboration and successful development, the first material specifically formulated for hot lithography 3D printing of LDS components is now a reality.

A Glimpse into the Future of MID Applications

This innovation has the potential to revolutionize the way 3D-MID prototypes are developed. With faster turnaround times, increased design flexibility, and seamless integration into existing workflows, direct 3D printing of LDS materials opens doors to a new era of efficiency and possibility in the 3D-Circuits industry.

Tigran Torosyan

Official representative of LITHOZ GmbH in Armenia and UAE

7 个月

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Tim Sandberg

3D Electronics Enthusiast / Chat with me about 3D-Circuits

7 个月

If you have any questions, do not hesitate to contact me??

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