Micron is the first to provide industry partners with high-speed, low-latency 128GB large-capacity RDIMM memory based on 32Gb single-die DRAM

【Lansheng Technology News】Micron Technology, Inc. recently announced the industry-leading launch of 128GB DDR5 RDIMM memory based on a 32Gb single die, with best-in-class performance up to 8,000 MT/s to support current and future data center workloads. This high-capacity, high-speed memory module is specifically targeted at a wide range of mission-critical applications in data centers and cloud environments, such as artificial intelligence, in-memory databases, and multi-threaded, multi-core general computing workloads that require efficient processing scenarios to meet their performance and data processing needs. Micron's 128GB DDR5 RDIMM memory based on 32Gb DDR5 DRAM die adopts industry-leading 1β (1-beta) process technology. Compared with competing products using 3DS through silicon via technology, it has been significantly improved in the following aspects:

● Capacity density increased by more than 45%

● Energy efficiency increased by up to 24%

● Latency reduced by up to 16%

● AI training performance improved by up to 28%

Micron's 32Gb DDR5 memory solutions feature an innovative die architecture that enables superior array efficiency and greater capacity density per DRAM die. Voltage domain and refresh management capabilities help optimize the power delivery network and achieve the required energy efficiency improvements. In addition, the aspect ratio of the die size is optimized to help improve the manufacturing efficiency of 32Gb high-capacity DRAM die.

By employing AI-driven smart manufacturing technology, Micron's 1β technology node has achieved mature yields at the fastest speed in the company's history. Micron 128GB RDIMM will ship in 2024 for platforms supporting 4800 MT/s, 5600 MT/s and 6400 MT/s rates, with support for platforms up to 8,000 MT/s in the future.

Dr. Dimitrios Ziakas, vice president of memory and IO technology at Intel, said: "We look forward to Micron's 128GB RDIMM solution based on 32Gb die bringing better bandwidth and performance per watt to the server and AI system markets. Intel is building on the cloud, AI and enterprise Customers evaluate this 32Gb die memory product based on total cost of ownership for critical DDR5 server platforms."

Micron's 32Gb DRAM die has higher bandwidth and energy efficiency to build 128GB, 256GB and higher capacity MRDIMM product solutions that are compliant with MCRDIMM and JEDEC standards, thereby expanding the memory product portfolio. With industry-leading process and design technology innovation, Micron provides a series of memory products covering RDIMM, MCRDIMM, MRDIMM, CXL and LP form factors, helping customers easily integrate these optimized solutions to meet the needs of AI and high-performance computing (HPC) Application requirements for high bandwidth, large capacity and low power consumption.

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