Memcon Question of the Week; What Design Consideration Should Be Used for Placing LEDs in Printed Electronics?
1206 LED Pad Design for Printed Electronics

Memcon Question of the Week; What Design Consideration Should Be Used for Placing LEDs in Printed Electronics?

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Noting substrate to ink is the weakest bond, consider the design incorporating a bond to substrate.

Printing a dielectric barrier between the pads both frames the conductive silver from shorting and raises the LED a bit to prevent conductive silver from being pressed out.

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?Two Adhesive System

–Center Drop of Acrylic Adhesive

–Two Drops of Conductive Adhesive


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?Encapsulation–Though not always needed will make more reliable though concerns exists about compatibility of UV encapsulant and conductive epoxies

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