Lyric's Semiconductor Glass Laser Drilling Equipment: Driving the Future of Electronic Packaging

Advancing Technology in the Era of 5G and AI

As cutting-edge technologies like 5G communication and artificial intelligence advance rapidly, the demand for high-performance electronic products continues to grow, fueling the evolution of advanced packaging technologies. Among these innovations, Through Glass Via (TGV) technology—a revolutionary advancement in microhole glass substrates—has demonstrated immense market potential within the modern electronics and semiconductor industries.

TGV technology is particularly crucial in fields such as AI computing packaging, RF (radio frequency) applications, optical communications, and Mini/Micro LED technologies. Its unique attributes, including superior high-frequency electrical performance, cost-effectiveness, simplified manufacturing processes, and outstanding mechanical stability, make it a key enabler in achieving miniaturization, lightweight structures, and multifunctionality in electronic products.

The Advantages of TGV Glass Through-Hole Technology

At the heart of TGV technology is the ability to create precision through-holes in glass substrates, enabling highly efficient chip interconnections. Compared to traditional Through Silicon Via (TSV) technology, TGV offers significant advantages:

• Superior Electrical Performance: Glass acts as an excellent insulator, minimizing substrate loss and parasitic effects, ensuring signal integrity and reliability.
• Thermal Expansion Control: The adjustable thermal expansion coefficient of glass helps mitigate risks of thermal mismatch between materials, improving overall system stability.
• Cost-Effective & Process-Simplified: Ultra-thin glass substrates are widely available, and unlike TSV, TGV does not require additional insulating layers, making the process more streamlined and cost-efficient.

These advantages make TGV an ideal choice for next-generation ultra-thin interposers used in high-performance semiconductor applications.

Lyric's Cutting-Edge TGV Processing Technology

Despite its promising applications, TGV fabrication poses significant technical challenges, requiring high-speed processing, high precision, narrow pitch control, smooth sidewalls, vertical alignment, and cost efficiency. Laser-induced etching has become the dominant method for creating TGV through-holes, and Lyric has pioneered an industry-leading approach.

Lyric's TGV fabrication process employs high-energy laser pulses to create controlled modification zones in the glass, followed by wet etching to produce precise through-holes. This method ensures superior accuracy, efficiency, and reliability, meeting the demanding requirements of next-generation electronic packaging.

Industry-Leading Semiconductor Glass Laser Drilling Equipment

Lyric’s semiconductor glass laser drilling equipment has reached an industry-leading level in multiple performance metrics, offering robust support for the advancement of electronic packaging technologies.

To further drive TGV research and applications, Lyric has also developed an advanced Semiconductor Glass Laser Drilling Experimental Platform. This state-of-the-art platform integrates:

• A manual loading and unloading system
• An industry-leading infrared femtosecond laser
• A Bessel beam focusing system
• A vacuum adsorption fixture

The platform accommodates glass substrates ranging from 100×100mm to 360×360mm, with thicknesses from 0.1mm to 1mm. Designed for use in cleanroom environments, it effectively prevents dust contamination, ensuring the cleanliness and precision of laser processing.

Shaping the Future of Electronic Packaging

With its cutting-edge technical capabilities and innovative process solutions, Lyric's semiconductor glass laser drilling equipment is poised to drive the future of TGV technology. It provides a powerful foundation for the next generation of electronic packaging, meeting the growing demands of the semiconductor and high-tech industries.