A Low-Cost, Near-Hermetic Air-Cavity Package for PICs: industry samples.
Industrial prototype of an LCP eared PIC package (unsingulated in lead frame).

A Low-Cost, Near-Hermetic Air-Cavity Package for PICs: industry samples.

I have reported last year twice on an ongoing activity at the Chip Integration Technology Center (CITC ) in collaboration with?RJR Technologies (RJR Technologies, Inc. ) to develop a Low-Cost, Air-Cavity Package for?Photonics Integrated Circuits (PICs) using existing air-cavity RF power package solutions using LCP injection molding technology.

Previous LinkedIn post on LCP PIC packages

This project is making steady progress. Several months ago the first production prototype batch was released with industrial quality and evaluation samples were provided to a couple of leading European photonic OSATs and academic institutes (Alter Technology UK, PHIX Netherlands and Tyndall University Ireland). A second batch is being produced to serve even more customers with demo samples.

A website is prepared with all relevant information: technical drawings, material specifications, different options, etc.

RJR Photonics packaging

The first prototypes are addressing the butterfly package market, but RJR is talking to customers about VCSELs and TROSA/ROSA layouts as well. The technology in general is wel suited to offer a large variety of solutions, some with surprising small NRE and time to market (eg different lead frame configurations can easily be included provided some overall dimensions are adhered).

One of the really new proposition that this technology offers is the fact that the products can be delivered singulated or in a lead-frame. Products in a lead frame offer strip-level assembly options, which is unique for butterfly packages and provides interesting cost-down opportunities in assembly.

If you have questions or would like to receive some demo samples yourself, please contact me:

Marco Koelink


Earless package
Eared package


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