A Low-Cost, Near-Hermetic Air-Cavity Package for Photonics Integrated Circuits (PICs).
I have previously reported on an ongoing activity at Chip Integration Technology Center (CITC) in collaboration with?RJR Technologies (technologies RJR Technologies, Inc.) to develop a Low-Cost, Air-Cavity Package for?Photonics Integrated Circuits (PICs) using existing air-cavity RF power package solutions using LCP injection molding technology.
I'm happy to report that we have made significant progress since then. We will shortly submit a full paper to the SPIE Journal of Optical Microsystems elaborating on the design and manufacturing processes for RJR Polymers injection molded air-cavity plastic package (ACP) in a butterfly package layout suitable for photonics and PICs applications. The LCP package solutions is not hermetic but can provide near hermetic performance as proven by the results in the RF power use case. The proposed package solution offers additionally flexibility in geometry and leadframe/heatsink materials combined with short prototype deliver times. Similarly leadframe designs and/or mentalizations can be changed relatively easy (even within an existing package design) and drop-in heatsinks can be chosen from different materials depending on cost, CTE expansion and/or heat conductivity requirements. Options include Cu, CuW, CuMo, KOVAR and more.
If you want to know more about this technology and want to see the demonstration prototypes for yourself, come and visit us at the upcoming Laser World of Photonics Trade show in Munich, 27-30 June 2023. CITC will be exhibiting at the Holland Pavilion in hall A2, booth 231/11.
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Brilliant! Why was the hermetic sealing in the first place needed ? I remember it as an expensive solution for most applications… Reliability driven, industry sector (space), lack of alternatives ?