Let's learn VIPPO process and quality standard--chart2

Let's learn VIPPO process and quality standard--chart2

VIPPO quality standard control, below solutions

Strictrly following up the two standard specifications files ,as below

  • IPC-6012E "Identification and Performance Specification for Rigid Printed Boards"
  • IPC-4761 "Design Guide for Printed Circuit Board Via Protection".

The main standard items are as follows:

1. Copper covering thickness standards: The measurement diagram is shown in picture below. The minimum thickness for level 2 standards is 5um, and the minimum thickness for level 3 standards is 12um.



2. Dent standard: Measurement pic, see Figure below, the maximum level 2 standard is 127um, and the maximum level 3 standard is 76um.


3.Bump standard: Level 2 and Level 3 standards, both are maximum 50um.


4. Residues of via resin fill material between the cap plating and underlying plating are acceptable as long as they do not extend beyond the vertical extent of the drilled hole wall.


5.For HDI boards, the standard diagram of acceptable voids between the electroplated copper layer and the copper-filled holes is as follows:


Further deatils, pls kindly check next chart

if you have any questions,pls kindly feel free to contact us

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www.sz-ztttech.com


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