LCP Air-Cavity packaging for Photonics: from Package to Portfolio
In an ongoing collaboration between the Chip Integration Technology Center (CITC) and RJR Technologies (RJR Technologies, Inc.) to develop a Low-Cost, Air-Cavity Package for?Photonics Integrated Circuits (PICs) using existing air-cavity (ACP) RF power package solutions using LCP injection molding technology, RJR is expending in partnerships and package layouts.
The initial focus was on 14-pins and 40-pins butterfly packages. Multiple photonics OSATs in Europe have already received one or multiple samples or will receive shortly a full demo-set (see figure 1). These OSATs (or universities) include:
RJR intends to announce a formal collaboration with one or more OSATs soon. Stay tuned...
The technology from RJR is also very suited for telecom packages (ROSA/TROSA). See in figure 2 and figure 3 two different design studies for telecom applications.
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Another example is shown in figure 4: a VCSEL design study. Large leads can be injection molded into an air-cavity plastic package, allowing for large drive currents. A glass top lid can be glued to the package with or without single- or double sided AR coatings.
Recently Opsys has partnered with RJR Technologies to achieve the high reliability and cost-effectiveness goals required for the design and development of its Advance Solid-State ALTOS (Advanced LiDAR Technology Opsys Sensors) LiDAR system.
An full article on this LiDAR package design is shown here:
See also figure 5 below.
Lastly, air-cavity QFN packages can be used for optical devices that are small but still require multiple electric IOs, for instance detector arrays. Similar to VCSEL packages, a glass top lid can be glued to the package with or without single- or double sided AR coatings. The QFN package can be designed according to JDEC standards or with customized number of electrical connections. See in figure 6 a photo of air-cavity QFN packages in strip format.
If you have questions or would like to know more about these or other LCP ACP package solutions for photonics, contact me:
Photonics, Microelectronics, Semiconductor Packaging and Surface Mount Technology SMT Sales Professional Consultant
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