Lasers help diamonds develop in semiconductors

Diamond properties and development challenges

A diamond is a crystal of carbon atoms tightly arranged in a tetrahedral structure. It is one of the hardest materials in nature. It has the characteristics of high hardness, excellent thermal conductivity, stable chemical properties, wide bandgap semiconductor, high electron mobility, and breakdown electric field. As a multifunctional carbon material, diamonds are widely used in industry, electronics, medicine, and energy.

At the same time, diamonds' excellent hardness and unique physical and chemical properties also bring technical and process challenges. For example, cracks, micro defects, and high surface roughness can easily occur during processing. The processing heat is difficult to dissipate effectively, which may cause carbonization, cracks, and mechanical property degradation of the diamond surface. Complex shape processing requires high precision and high efficiency, and traditional processing methods are difficult to meet the needs.

With the multi-faceted technical and process challenges of diamond processing, Maiman Laser has occupied an important position in carbon material processing with its unique leading laser technology.

Maiman Laser's technical response

As a technology-leading company, Maiman Laser is committed to developing and applying advanced laser technology, bringing important technological innovations and solutions to the diamond industry.

The unique ultraviolet laser technology solves the problems of low power, short life, and frequent maintenance of domestic ultraviolet lasers, achieves high power output and long-term stability, and breaks through the industry's technical bottleneck.

Maiman has pioneered a unique UV laser technology route different from other companies' similar technologies. Since 2015, this route has gone through 27 iterations and successfully solved the technical problems of laser power attenuation and high-power breakthroughs, making its products far superior to its competitors in terms of advancement, stability, and performance.

Maiman's independent research and development capabilities enable it to produce key components in-house, effectively reducing costs. At the same time, its self-built efficient production line makes its production efficiency three times that of its peers, strengthening its market competitiveness.

Solid MOPA amplification and nonlinear frequency conversion technology have created a new amplification technology, effectively increasing laser power and single pulse energy, breaking through the upper limit of power and energy of domestic solid lasers. Using this technology, Maiman successfully developed large-scale, commercially available laser energy lasers to fill the domestic gap. At the same time, the ultraviolet laser power will be increased to 100W, especially in terms of stability, which is more than twice that of other companies, with significant advantages.

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3. Application of Maiman laser in diamond industry

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Maiman Laser's products are widely used in semiconductor industry applications such as diamond wafer scribing, grinding, annealing, and marking.

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Diamond wafer processing

In diamond wafer processing, Maiman uses a new process to simplify the processing steps, shorten the cutting time, and reduce the edge collapse rate and wafer damage. Compared with traditional ns or ps lasers, the processing time is reduced by 37 times, so no cracking and severe carbonization will occur; the edge collapse rate is less than 2um, the edge collapse rate is low, and the edge is neat.

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Diamond wafer dicing

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One laser solves all processing problems with simplified processing steps. Compared with the traditional laser cutting process, the surface metal layer needs to be removed in advance before laser cutting. Maiman's process solution is direct cutting without pretreatment, greatly simplifying the process.

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Maiman's ELITE series high-energy UV laser can completely cut diamond wafers, and the edge collapse (heat-affected area) is less than 2um

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The laser only takes 7.5 minutes to cut a 4-inch diamond wafer. It integrates automatic loading and unloading, coating, cleaning, positioning, and other processes, and the total processing time does not exceed 15 minutes. Therefore, under 24-hour continuous operation, 96 wafers can be cut.

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Diamond Wafer Grinding

During the wafer grinding process, Maiman's ELITE series high-energy UV lasers can balance efficiency and surface roughness and systematically reduce the risk of microcracks inside the wafer.

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For diamond wafers of different thicknesses, Maiman has launched multiple wavelength lasers for more professionalism.

Maiman's UV laser is expected to become a key solution for ultra-thin diamond wafers. The laser only acts on the upper surface and will not affect the inside, reducing the risk of subsequent processing and fragmentation.

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Maiman's diamond wafer grinding solution fills the gap in domestic laser processing.

Wafer grinding-green light solution: high efficiency, Ra 6-12um

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The solution is improving; the target surface height difference is less than 10um, Ra 0.1um.

In the CMP diamond disc etching test, the diamond with a side length of 10mm completes the pyramid etching in less than 15 minutes, while other laser processing requires 2-3 hours per disc. Microscope observation shows that the pyramid structure is intact, without fragmentation and carbonization, with good consistency and no carbonization, ensuring long-term wear resistance. Maiman's high-precision, micron-level processing provides the most effective solution for the mass production of diamond discs.

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4. Product description

Maiman Laser focuses on providing efficient solutions for diamond processing with its superior technology and innovative products. In particular, its ELITE series lasers, with their excellent power stability and high single pulse energy, are the best choice for processing materials with higher hardness. The following are the specific applications and features of the ELITE series lasers in the field of diamond processing:

ELITE Series Lasers

· Wavelength: 266/355/532/1064nm

· Average power: 15-140W

· Single pulse energy: 1-10mJ

· Beam quality: <1.2

· Frequency: 7-200kHz

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Main feature

· Excellent power stability: ensuring the stable output of the laser during long-term operation and improving the reliability of the processing process.

· High single pulse energy: Produces higher energy density quickly, allowing it to more effectively cope with the processing needs of high-hardness materials such as silicon carbide and diamond.

· Efficient cutting: It is especially suitable for efficiently cutting SiC and diamond wafers. It can directly cut off the wafer and metal layer, significantly improving processing efficiency and accuracy.

By providing efficient and precise processing solutions, Maiman Laser has successfully addressed many challenges in processing diamonds as carbon materials in the semiconductor field. These solutions improved the processing quality and efficiency of diamond materials and promoted their widespread application in the semiconductor industry.

In the future, with the continuous advancement of science and technology and the continuous growth of market demand, Maiman Laser will continue to be committed to technological innovation and product optimization to promote the further development of the diamond industry.

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