Large Power Consumption And Small Size? What Other Ways To Improve Power Supply Stability?
Power supply is an indispensable device in electrical equipment. Its application market involves electronic and electrical equipment, electronic testing equipment, control equipment, computers, home appliances and other electronic industries. Power supply has become an extremely important basic industry.
With the continuous advancement of Industry 4.0 and the continuous development of 5G, new requirements for power supply technology have been put forward, such as shorter development cycle, smaller solution size, heat dissipation of the system and power supply, suppression of EMI noise, etc.
Power is the heart of all electronic products, and 60% of the failure rate of electronic products comes from power.Nowadays, the layout area is getting more and more compact, and the limited space puts forward new requirements for the heat dissipation of the power supply, especially in harsh environments such as industrial and base stations.
The main components of the power supply such as power transformers, rectifier diodes, switch V-MOS tubes, etc. during the power-on process, if the heat generated is too high, the components will not work normally, or the power supply will be destroyed in severe cases.
Therefore, temperature is one of the important factors affecting equipment reliability, and measures must be taken to limit the temperature rise of components to ensure the normal operation of the power supply and extend its service life.
Pinshuo is committed to providing thermal insulation solutions for emerging power products from traditional power adapters, industrial power supplies, communication power supplies, LED power supplies, UPS power supplies to charging piles, DC-DC, DC-AC inverters, etc.
The thermal interface materials favored by the power supply industry are thermal insulation pad and silicone potting compound, which are characterized by low thermal resistance and high insulation performance.
The high-voltage MOS package has a high voltage and a large amount of heat. It is necessary to add an additional metal heat sink or be assembled on a heat sink such as a metal shell middle frame to dissipate heat, otherwise there is a risk of burning the bomber.
A thermal interface material with high insulation properties needs to be filled between the MOS package and the heat sink to meet the performance requirements of low thermal resistance and high insulation.
Thermally conductive insulating material is a high-performance thermally conductive insulating material with glass fiber cloth as the base material. It has excellent tear resistance,stretchability, excellent thermal conductivity and insulation performance (breakdown voltage greater than 4~6KV). It is widely used in MOS packaging and heat sink.
Thermally conductive potting glue is widely used in power supply products for waterproof, dustproof, shockproof and magnetic core protection and thermal conduction solutions.
It has excellent characteristics such as low density, low viscosity, good self-leveling, high thermal conductivity, and easy disassembly and repair. It is widely used in the power supply industry use.
Some data for potting compound:
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Editor:Winfa([email protected])
Date:7/1/2021