Lab-Verified Results of Real-Time Verification of Component Defect Detection by #Cybord AI System
(Left) The deviation is visible during mounting, (Center) The deviation is hidden after mounting, (Right) The defect is exposed by the lab.

Lab-Verified Results of Real-Time Verification of Component Defect Detection by #Cybord AI System

In today's #manufacturing environment, ensuring the #quality and #reliability of #electroniccomponents is paramount. With the increasing complexity of electronic devices, even minor defects can lead to significant failures and performance issues. In this article, we will go into recent verification tests conducted on Cybord's Aquila, a body defect detection system, showcasing its effectiveness in enhancing component quality and reliability.

Cybord's innovative system was deployed in line with ASMPT pick-and-place machines, allowing real-time inspection of electronic components during the assembly process. By analyzing bottom-side images of the components taken during mounting, the system swiftly detected body defects and triggered immediate action through the Manufacturing Execution System (MES). Detected defective printed circuit boards (PCBs) were efficiently moved to the non-conforming (NG) tray for further analysis, ensuring that only components meeting quality standards proceed in the production line.

To validate the efficacy of Cybord's detection system, PCBs identified with body defects were subjected to rigorous laboratory analysis. The comprehensive analysis confirmed that the detected defects indeed deviated from IPC-A-610 requirements, underscoring the system's accuracy in identifying real-world defects that could impact component reliability.

Furthermore, in this case, the failure in the chip resistor was caused by contamination within the soldering leads visible only from the bottom side. This contamination strained and ripped off the lead during the reflow process. As contaminants may evaporate or expand in heat in an uncontrolled way, they may cause severe strain on the surface of the sensitive component, leading to delamination, cracking, tear-downs, and pill-offs. This violation of IPC-A-610 sections 10.64.4 and 8.2.2 underscores the importance of Cybord's detection system in preventing such failures.

One striking example from the verification tests highlights the system's ability to detect body defects that evade traditional in-line tests. In the provided image, a body defect on an electronic component is clearly visible from the bottom side, yet remains undetectable from the top side. This hidden defect, which caused a deviation in the leads, ultimately resulted in lead failure, however, it passed the inline tests.

The results of the recent verification tests highlight the indispensable role of Cybord's software in enhancing quality and reliability. By seamlessly integrating into the production line and providing real-time detection of hidden defects, the system ensures that only high-quality components proceed in the manufacturing process. As electronic devices continue to evolve in complexity, investing in advanced detection systems like Cybord's becomes imperative for maintaining product integrity and customer satisfaction.

~Ramon Koch

Master IPC Trainer at ETECH-trainingen

1 年

I see IPC-A-610 being referenced to. This issue is much better tackled in J-STD-001 where there's a lot more on solderability and component damage. Also J-STD-001 will detect this issue in advance, instead of end-of-line.

要查看或添加评论,请登录

Eyal Weiss, Ph.D.的更多文章

社区洞察

其他会员也浏览了