Key point of FPC process control

Automatic cutting

Cutting the first stop for the entire FPC raw material production, its quality problems have a greater impact on the latter, but also a cost control point, due to the higher degree of cutting machinery, mechanical properties and maintenance are important and the accuracy of the cutting machine equipment basic Can achieve the cutting precision requirements, so in the operation of the operator skills and proficiency and responsibility to focus on.

1 understanding of raw material coding

Such as; B 08 N N 0 0 R 1 B 250

B Copper Foil 08: Manufacturer Code 1N Layer, N, Copper S, Single Panel D, Double Panel 2N Insulation Category N. Without Insulation Category K.kapthon P.polyster 10 Insulation Thickness 0, None 1: 1mil 2: 2mil 20 Insulation between the copper and the adhesive without adhesive 0; no 1; yes

R, copper category A: aluminum foil H: high ductility electrolytic copper R: rolled copper E: electrolytic copper 1, copper thickness B, copper skin treatment R: Browning G: normal 250, width code

Coverlay coding principles

2 process quality control

According to the first piece

A. The operator should wear gloves and finger cots to prevent oxidation of the surface of the copper foil due to contact with the perspiration on the hands.

B. The correct way of material, to prevent wrinkles.

C. Can not be cut off, hand punching punching positioning holes and holes can not be punched. Unless otherwise specified cutting tolerance when the cut is ± 1mm in the D. cut in 0.3mm

E. Cutting size can not have a greater error, but also pay attention to its verticality, that is, when cut into four sheets should be vertical (<2 °)

G. Material quality, the surface of the material can not have wrinkles, stains, heavy oxidation phenomenon, the cutting material can not have flash, excess glue and so on.

3. Mechanical maintenance

In strict accordance with the <automatic cutting machine maintenance inspection record> of the implementation.

CNC:

CNC is the first stop of the whole FPC process, the quality of which has a great impact on the follow-up process.CNC basic process: board → PIN → drilling → back PIN.

Panels

Select cover → panel → tape bonding → arrow (mark)

Basic panel requirements:

Single 15 single copper 10 or 15 double-sided 10 single 10 or 15 copper

Yellow Coverlay 10 sheets or 15 White Coverlay 25 sheets A strong plate 3-6 sheets depending on the situation

The main function of the cover: A: to reduce the feathering B: to prevent the pressure on the material surface caused by the rig and the pressure foot C: to make the center of the drill easy to avoid the deviation of the drilling position D: Hole wall friction heat generated to reduce bit twist.

2). Drill control methods

a. Control of number of uses b. Identification of new drill bits c. Inspection of new drill bits

3). Quality control points

a. Correctness; b. According to the drilling and drilling data to confirm the product hole and c. Hole number correctness, and check the needle monitoring hole is fully conductive.

d. the appearance of quality; e. can not have Alice, the bad edge of the phenomenon.

4) Process control

a. Product Confirmation b. Process Confirmation c. Combination Confirmation d. Dimension Confirmation e. Position Confirmation f. Program Confirmation g. Tool Confirmation h. Coordinate Confirmation i.

5) Common bad performance is the reason

Broken needle a. Rig improper operation b. There are problems with the drill bit c. Feed too fast and so on

Burr a. Cover, pad is not correct b. Drilling conditions are not c. Electrostatic adsorption and so on

7). Good drilling quality

a. operator; technical ability, responsibility, proficiency

b. drill; material, shape, number of drill, drill tip

c. Platen; mat; material, thickness, thermal conductivity

d. Drilling machine; vibration, position accuracy, clamping force, auxiliary performance

e. drilling parameters; sub / single processing method, the number of revolutions, feed retraction speed.

f. processing environment; external shock h. moving, noise, temperature, humidity.

P.T.H station

1.PTH principle and role

PTH is a process of redox reaction of autocatalytic (palladium and copper atoms as a catalyst) in the plating solution to deposit copper ions on the surface of the activated pore wall and copper foil under the condition of no current applied, also called For electroless copper plating or autocatalytic copper plating, the chemical reaction equation:

2. PHT process and the role of each step

Whole hole → washing → micro-erosion → washing → pickling → washing → washing → pre-impregnation → activation → washing → speed → washing → washing → chemical copper → washing.

a. The entire hole; clean the board surface, the hole wall of the negative charge polarization for the political charge has been beneficial and negatively charged palladium colloid adhesion.

b. Micro-etching; cleaning the surface of the plate; roughening the surface of the copper foil to increase the adhesion of the coating.

c. pickling; clean the board; remove the oxide layer, impurities.

d. prepreg; to prevent the activation tank pollution.

e. activation; palladium colloid attached to the hole wall.

f. Speeding; Pd ions are reduced to Pd atoms, the chemical copper tin plating up.

g. Chemical Copper: Copper is deposited on the surface of the cell walls and copper foil by chemical reaction.

3.PTH common adverse conditions of treatment.

Hole without copper

a: activated palladium adsorption deposition is not good.

b: Speed tank: speed improver is not soluble.

c: chemical copper: the temperature is too low, the reaction can not be carried out too slow reaction speed; bath components wrong.

2. Hole wall with particles, rough

a: chemical tank with particles, copper uneven deposition, to be installed filter device.

b: plate itself burr hole wall.

3. Black board

Chemical tank composition wrong (NaOH concentration is too high)

Copper:

Copper plating is to improve the uniformity of the hole plating to ensure that the entire layout (hole and the orifice near the entire coating) coating thickness to meet certain requirements.

Process control: product confirmation, process confirmation, liquid confirmation, machine parameters to confirm.

Quality control:

1, continuity: the first slot pumping 2, with 20 times the magnifying glass to check whether there is copper hole wall completely attached through.

2, the surface quality: copper surface can not have charred, peeling, granular, pinhole and dysplasia and other phenomena.

3, Adhesion: At any edge of the board is about 2.54 * 2.54cm2 area to cut the shaft from the axis of the cut 10, 3M tape and then paste for 3 minutes, the vertical upward pick up may not have shedding phenomenon.

Chemical copper should be trough every week, the role of: copper deposition in the bottom of the tank, the bottom of the copper more and more consumption of syrup more, so that the cost becomes high.

Slice experiment:

program:

1, ready for slicing the required acrylic powder and medicine, Vaseline, fixtures, utensils.

2, according to the requirements of sampling production test piece.

3, now the inner surface of the vessel evenly coated with a layer of lubricating Vaseline.

4, the test piece clip with a good folder into the vessel.

5, the acrylic powder and acrylic syrup to 10: 8 ratio after mixing slowly poured into the vessel.

6, to be solidified after its removal directly.

7, the slice on the metallographic sample pre-mill grinding and polishing to meet the requirements after the observation with a metallurgical microscope and record its value.

Foil:

1, the dry film affixed to the plate, the exposure after the development, so that the basic line shape, in the process of dry film mainly played the role of image transfer, but also in the etching process to protect the role of the line.

2, the main components of dry film: PE, photosensitive resist, PET. PE and PET only play a protective and isolation role. Photosensitive resists include: linkers, initiators, monomers, adhesion promoters, colorants.

Work requirements:

1 ﹑ keep the dry film and board clean.

2 ﹑ flatness, no bubbles and wrinkles phenomenon.

3 ﹑ adhesion to meet the requirements of high degree of confidentiality.

Job quality control points:

1, in order to prevent the film when the phenomenon of disconnection, you must first remove the foil surface with dust-free paper impurities.

2, should be set according to different plate heating roller temperature, pressure, rpm and other parameters.

3, to ensure the direction of the copper hole in the same direction.

4, to prevent oxidation, do not directly contact the surface of the copper foil, if you want to use the fiber brush to brush the oxide oxidation phenomenon.

5, the heating roller should not have scars, to prevent wrinkles and poor adhesion.

6, after leaving the film 15min-30min, and then to the exposure, the time is too short will make the dry film by UV light irradiation, the occurrence of organic polymerization reaction is not complete, too long is not easy to be hydrolyzed, resulting in poor residue coating.

7, often with clean paper wipe the impurities on the heating roller and excess glue.

8, to ensure good adhesion film.

Quality Confirmation:

1, Adhesion: Hitachi film after the test film to be tested by the development of the line after exposure can not bend deformation or broken (with a magnifying glass test)

2, formation: to be smooth, not wrinkles, bubbles.

3, cleanliness: Each must not have more than 5 points of impurities.

exposure:

1. Principle: the line through the role of dry film transferred to the board.

2, homework points:

Work to keep the film and the board clean; film and board should be aligned, correct; can not have bubbles, impurities; put films should pay attention to the hole exposed.

Double-sided operation should be black pad paper to prevent exposure.

Quality Confirmation:

1, Accuracy: a. Positioning hole offset within + 0.1 / -0.1

b. Solder joint tin ring not less than 0.1mm (not hole broken principle)

c. tin through the hole should not be less than 0.1mm (not hole broken principle)

2. Line quality: There can be no negative film factors fixed line, pinhole or short circuit phenomenon.

Film specifications, exposing machine exposure energy, film and dry film closeness will affect the line of precision.

* For vacuum purpose: to improve the film and dry film contact to reduce the degree of tightness astigmatism.

* The level of exposure energy also has an impact on the quality: 1, low energy, underexposed, resist after imaging is too soft, dark color, etching resistance agent destruction or floating, resulting in circuit breaking.

2. high energy, it will cause over-exposure, the line will be narrowed or exposed areas easy to wash off.

Development:

Principle: Development is the exposed film with a dry film, after the developer (7.9g / L of sodium carbonate solution) treatment, the UV light is not the dry film was washed away leaving under UV light irradiation polymerization The dry film of the reaction formed the wire essentially.

Factors affecting the quality of imaging operations:

1 ﹑ developer solution composition.

2 ﹑ development temperature.

3 ﹑ developing pressure.

4 ﹑ uniformity of developer distribution.

5 ﹑ speed of rotation of the machine.

Process parameters control: liquid solubility, development temperature, development speed, spray pressure.

Developing job quality control points:

1 ﹑ outlet should not have water droplets on the wrench, should be clean.

2 ﹑ can not tear the dry film protective film.

3 ﹑ development should be complete, the line can not be jagged, curved, thinner and so on.

4 ﹑ After developing naked copper surface with a knife light scraping dry film may not shed, otherwise it will affect the moment of job quality.

5 ﹑ dry film line width and film width control within +/- 0.05mm error.

6 ﹑ Line complex side down, to avoid residual film residue, reduce the pool effect caused by uneven development.

7 ﹑ According to the solubility of sodium carbonate, dry film load and the use of time to update the liquid in time to ensure the best development effect.

8 ﹑ control the developer, water level.

9 ﹑ drying wind should be kept to the inside 5-6 degrees.

10 ﹑ should be regularly cleaned tank and nozzle, the scale in the nozzle to prevent impurity contamination of sheet metal and cause uneven distribution of the developer.

11 ﹑ To prevent the operation of the card board, card board should stop rotating device, should immediately stop putting board, and take out the sheet sent to the center of the developing station, if not fully developed, due to secondary development.

12 ﹑ After the development of dry board should be separated from the absorbent paper to prevent dry film adhesion and affect the etching quality.

Quality Confirmation:

Integrity: bare copper surface after imaging blade can not be scratched with a dry film residue.

Appropriateness: the edge of the line can not be jagged or lines significantly thinner, tilt phenomenon, after imaging, dry film line width and the film line width to be within the range of 0.05 / -0.05 m.

Surface quality: to be dry, can not have water droplets.

Etching stripping film:

Principle: Etching is under certain temperature conditions (45 +5) Etching liquid evenly sprayed through the nozzle surface to the copper foil, with no etching resist protection of copper redox reaction, and the unwanted copper reaction , Exposing the substrate and then after the film stripping process to shape the line.

Etching liquid main components: copper chloride, hydrogen peroxide, hydrochloric acid, soft water (solubility has strict requirements)

Quality requirements and control points:

1 ﹑ can not have residual copper, especially double-sided board should pay attention.

2 ﹑ There can not be residual plastic, or it will cause poor adhesion of exposed copper or coating

3 ﹑ etching rate should be appropriate, not allowed to appear excessive etching caused lines thinning, etching line width and total pitch should be the focus of site control.

4 ﹑ line solder joints on the dry film shall not be washed apart or broken

5 ﹑ etching sheet after peeling film is not allowed to have oil, impurities, such as copper tilt up poor quality.

6 ﹑ plate should be taken to avoid pallets, to prevent oxidation.

7 ﹑ should ensure that the liquid chemical etching evenly distributed to avoid causing the front and back or the same side of the uneven etching of different parts.

Process control parameters:

Etching syrup temperature: 45 +/- 5 ℃ Hydrogen peroxide solubility: 1.95 ~ 2.05mol / L

Film stripping liquid temperature: 55 +/- 5 ℃ Etching machine safe use temperature ≦ 55 ℃

Drying temperature: 75 +/- 5 ℃ Front and rear board spacing: 5 ~ 10cm

Copper chloride solution Specific gravity: 1.2 ~ 1.3g / cm3 Plating angle ﹑ guide plate, up and down nozzle switch state

Hydrochloric acid solubility: 1.9 ~ 2.05mol / L

Quality Confirmation:

Linewidth: The standard etching line is .2mm & 0.25mm, which must be within +/- 0.02mm after etching.

Surface quality: not wrinkles and other scratches

To check the way light can not have residual copper.

The line can not be deformed

No oxidized water droplets.

Tinned

A ﹑ common defects in the process and its causes:

Poor bonding (poor adhesion). Pre-treatment is not good; current is too large; there is pollution such as copper ions.

2. The coating is not bright enough. Not enough additives

Gas serious. Free acid too much; divalent tin concentration is too low.

4. Coating turbidity. Tin colloids too much to form a precipitate.

5. The coating is dark. Anode mud too much; copper foil pollution.

6. Tin thickness is too large. Plating time is too large;

7. Tin thickness is too small. Electroplating time is not enough

8 exposed copper. There is excess glue

Second, quality control:

1 ﹑ first piece of test must be 3M600 or 3M810 tape pull test to verify its adhesion

2 ﹑ should check whether the coated point is completely plated, not exposed without copper and exposed

3 ﹑ must have gloss, can not have black, rough or scorched

4 ﹑ with x-ray thickness meter measurement of coating thickness

* In the current density of 2ASD, the more plated 1um 1 minute.

Third, plating conditions set to determine the factors:

1 ﹑ current density selection

2 ﹑ plating area size

3 ﹑ coating thickness requirements

4 ﹑ plating time control

Fourth, the appearance of inspection:

1 ﹑ coating thickness measurement tool for the X-Ray measuring instrument

2 ﹑ coated by the point of complete plating, there should be no omission not plated on the abnormal phenomenon

3 ﹑ coating can not be black or rough ﹑ burning

4 ﹑ plating can not have pitting ﹑ exposed copper ﹑ color ﹑ hole ﹑ bumpy phenomenon

5 ﹑ 3M600 or 3M810 tape test pull, can not have the phenomenon of falling off

Grinding (grinding plate):

Grinding is an auxiliary process that may be used multiple times during FPC manufacturing. As a pretreatment or post-treatment process for other processes, pickling, microetching or oxidation treatment of the board is generally performed first, and then the nylon wheel brush is used to brush the surface of the board Brushing to remove impurities on the surface of the board, black layer, residue and so on.

Grinding program: Into the material - to black layer - washing - grinding brush - pressurized water washing - water squeezed dry - dry - drying - the material

Grinding type:

1 ﹑ To be film: double-panel to oxidation, stretching (hole offset) Single-panel: to oxidation

2 ﹑ pending leave Coverlay: polished, to the erythema (stripping NaOH residue), to oxidation

3 ﹑ pending leave shop strong: polished, clean

4 ﹑ pending plating: polished, clean, increase adhesion

5 ﹑ plating: drying, improve gloss

Surface quality:

1. The required grinding at uniform grinding brush marks.

2. Surface to be completely dried, can not be oxidized or water droplets and so on.

3. Do not have to cut water roller wrinkles and crush.

4. Do not have copper due to brushing or copper buildup tilting edge of the coverlay tilt situation.

Common bad and prevention:

1 ﹑ surface traces of water droplets, sponge wheel at this time should check whether the wet, should be regularly cleaned, water squeezed.

2 ﹑ oxide water completely removed, check the brush wheel pressure is sufficient, the transfer speed is too fast.

3 ﹑ black layer is not clean

4 ﹑ brushing uneven, you can use a single piece of copper foil brush inspection is uniform.

5 ﹑ due to cardboard caused by wrinkles or broken line.

Fake stickers:

Fake affixed to the protective film, the shop-board and Beijiao plastic; protective film is mainly insulated, anti-solder line protection to increase the flexibility of flexible board and so on; paving strong board is mainly to improve the mechanical strength, guide the FPC terminal insertion Connector role; Beijiao mainly played a fixed role.

Operating procedures:

1, prepare tools to determine the number of semi-finished products to be fake, ready to coverlay semi-finished products.

2 rip off Coverlay release paper.

3 ﹑ copper foil can not be oxidized, check the clean copper foil: brushed brush surface to brushed debris or impurities.

4, will be the correct coverlay according to the work instructions will be the correct coverlay according to work instructions and test standard card position and the provisions of the position, to iron fixed.

5 ﹑ After the fake semi-finished products should be sent to the hot pressing station pressure to prevent oxidation work.

Quality control focus:

1, physical instructions required to work instructions and test standard card coverlay naked and drilling position is correct.

2, The exact offset of the coverlay alignment on the soldering and terminating ends shall not exceed the requirements of the working instructions and the inspection standard card.

3 ﹑ plating tin or gold electroplating, must set aside plating seams, usually 5cm.

4 ﹑ copper foil can not be oxidized, coverlay bare edges can not have flash, coverlay can not have impurities left.

5, the implementation of quality sampling.

6. The working tools can not be put on the wrench, otherwise it may cause scratches or crushing.

Visual inspection:

1. Copper foil can not be oxidized.

2.coverlay naked edges and paved edge can not have flash.

3.coverlay and pavement should not have impurities inside.

3 shop strong can not have missed the situation.

4. The use of machinery products, need to test it can not have bubbles, bad fit, the combination of displacement of the situation.

Hot pressing:

Hot pressing operations include the traditional pressing, cold pressing, rapid lamination, B baking and other steps; the purpose of hot pressing is to make the protective film or paved plate fully bonded to the wrench, according to the curing method can be divided into pressure Glue and thermosetting glue to achieve good adhesion by controlling the temperature, pressure, lamination time, the stacked combination of secondary materials, etc., and to minimize crushing, air bubbles, wrinkles, overflow Plastic, broken and other bad, according to the combination of deputy materials into single-sided pressure and double-sided pressure method.

First, fast pressure:

1. Combination: single-sided pressure and double-sided pressure, commonly used single-sided pressure.

2. Fucai used and its role

(1) Fiberglass cloth: isolated ﹑ off

(2) Nifluoron: dust-proof, anti-pressure injury

(3) burning iron plate: heating ﹑ gas

Second, the traditional pressure:

1 ﹑ combination: single-sided pressure and double-sided pressure

2 ﹑ Fucai extremely useful role:

(1) Talc: reduce viscosity, prevent wrinkles

(2) T.P.X: isolated, dustproof, anti-impurity

(3) cardboard: buffer pressure

(4) aluminum alloy plate: flatness

Three ﹑ important operating parameters:

Temperature ﹑ pressure typesetting ﹑ press time

Fourth, the common cause of the most likely bad:

1 ﹑ bubble:

(1) Silicone film, cardboard and other sub-materials can not be used

(2) plate is not flat

(3) protective film expired

(4) parameter setting error, such as the pressure is too large pre-pressure time is too short.

(5) typesetting is wrong

2 ﹑ crushed:

(1) auxiliary material is not clean

(2) T.P.X placement problem

(3) glass cloth placement problems

3 ﹑ reinforcement plate shift

(1) Instantaneous pressure is too large

(2) Reinforcement is too thick

(3) reinforce the false discount is not strong (grinding quality is not good)

4 ﹑ over plastic:

(1) lack of plastic material resistance

(3) protective film burrs more serious

(4) parameters and typesetting errors, such as fast pressure is too large.

5 ﹑ poor total Pitch:

(1) lamination method is wrong

(2) shrinkage calculation is incorrect

Five ﹑ quality assurance:

1. After pressing to be smooth, not wrinkles ﹑ crushed ﹑ ﹑ bubble curling and so on.

2. The line can not be pulled by the impact of pressure fracture situation.

3.Coverlay or paved strong board must be completely close to the light stripping can not be stripped of the phenomenon.

   Screen Printing:

 First, the basic principles of screen printing:

 Polyester or stainless steel mesh cloth as a carrier, the positive and negative film patterns in direct latex or indirect plate mode transfer to the mesh cloth to form a screen, as the opposite printing tools.

 Second, the printing ink used in the classification and its role:

 Anti-welding ink ---- insulation, protection circuit

 Text -------- mark line markings

 Silver paste -------- anti-electromagnetic interference

 Peel glue ------ anti-plating

 Acid -------- filled, anti-corrosion agent

Third, the quality of confirmation

1. Print the location of the positive and negative directions must be consistent with the work instructions and test standards on the card.

2. Do not have halo open, fixed break, pinhole situation

3. General overprint logo on the bit +0.5 mm / -0.5mm, such as work instructions and inspection standards card has a special screen printing requirements, its excellent.

4 by the delivery of hot baking, 3M tape should try to pull, not the phenomenon of ink off.

Note: the temperature of the transport bake should be suitable to avoid tin-lead melting of some shiny tin-lead semi-finished products.

SMT:

Principle understanding:

SMT that is surface mount technology, is a kind of stresses on the part of the surface of the circuit board soldering process, so that the surface of the pad and solder the combination of the end.

The main conditions for good welding: a. To ensure the good surface of the metal solder and welding conditions required for the fit

b. Select the appropriate flux

c. The correct solder alloy composition

d. Adequate heat suitable for the heating curve.

Common bad phenomenon:

1.conn: parts deformation, foot crooked, solder resist creeping.

2.FPC: bubbles, crush, wrinkles, peeling stripe, welding parts.

3. Pad: short circuit, air welding, cold welding, tin, tin tip, tin and more, including welding, 仳 from

4.other: tin beads, tin slag, solder resist, debris residues.

 SMD Heavy Industry Program:

1. Short circuit: direct use of soldering iron will cause short-circuit the removal of the tin.

2. Air welding: direct use of iron to make up tin.

3. Cold welding: cold welding products back to the furnace melting Taiwan.

4. Insufficient solder paste: solder directly to the tin up.

5 package welding: direct use of iron to suck the excess tin.

* The same product can not be reworked more than 2 times.

Processing:

* Processing methods are divided into the use of machinery and no mechanical two, the processing is mainly affixed shrapnel, gum or shop strong board, processing operations should pay attention to prevent poor fit, air bubbles and wrinkles and other undesirable quality problems.

* Tape classification: 1. Sense adhesive 2. Heat-curing glue 3. Water-based glue;

Commonly used is no substrate pressure sensitive double-sided adhesive;

Sensitive adhesive definition:

1. Natural viscoelastic properties

2. Fast and long-lasting stickiness

3. Light pressure that has good characteristics

4 have better retention

5. Adequate cohesion and flexibility

The benefits of pressure-sensitive adhesive:

1. Do not need to be coated or mixed pretreatment steps.

2 uniform amount of glue

3. Use convenient, fast

4. Can be cut into various shapes

5. Long-lasting viscoelastic to avoid embrittlement and short cracks and other phenomena

6. When used without odor, tasteless and solvent-free.

Quality Confirmation:

Beijiao: Do not touch or shrink plastic caused by the adhesive is not complete, can not miss stickers.

Affixed shrapnel: shrapnel affixed to the positioning hole can not be damaged situation.

After the shrapnel fit can not be displaced, impurities, shrapnel edge can not have flash edges of the situation.

Fold: reflex can not be a serious case of excess plastic, to be smooth, can not be refolded after the pop-up situation.

Reciprocating position must be consistent with the physical indication of the work instruction test card.

Fold size must be consistent with the work instructions and test standard card size tolerances.

Combination: with the work instructions and test standards on the physical affixed to the location, the same direction.

Affixed opp plastic: affixed to the correct location, should be smooth, not wrinkles, bubbles.

Posted conductive fabric: flat, no flash edge, paste partial.

Processing shop strong: the location is correct, smooth, no flash edge, missed paste.

Punching:

Common bad: red bias, crush, red anti-flash, Alice, FPC damage and so on.

Process control key: mold correctness, directionality, size accuracy.

Homework points:

1 ﹑ hand cut the scope of the line should not exceed the cut line width.

2 ﹑ test the product after the test bit, we must cut its conductive wire.

3 ﹑ punching and testing holes can not be punctured hole

4 ﹑ product surface can not be scratched, wrinkles and so on.

5 ﹑ red offset can not exceed the specified range.

6 ﹑ correct use of the same number of mold.

7 ﹑ can not have serious burrs or pulling material, tearing or abnormal bump or adhesive residue and reinforcement offset, release paper off phenomenon.

8 ﹑ safe operation, in accordance with the safety manual operation.

Common bad and its reason:

1. Chong a: a man-made reasons (because the FPC is softer, punching staff if the tension, the force pulled too large, the hole deformation)

b: other stations do not automatically cut (positioning hole cut)

Luminous (hole deviation)

CNC

Screen printing, etching (poor printing, etching the aperture etching is too large) Fake affixed, processing (punching holes cover)

2. crush a: blanking die b: composite mode

3. Alice Alice a: slow, low pressure

b: blade blunt (take off the plate mold can not have gaps, this easy to produce pull material)

4 red anti a: feeding direction error (under normal circumstances, the copper mold surface up, die surface down)