Join HOREXS in Munich electronics fair
AKEN Cheung 封装基板制造商
Director . Advanced packaging IC substrate manufacturer. Advantages: Cost reduction with realiability. FCBGA/ FCCSP/ CSP/ SiP/ Module/ BGA memory DDR3/DDR4/DDR5/ mmwave/ Embedded/ PCB substrate, uHDI PCB etc. mSAP
Welcome to join us and discuss the future product of semiconductor!
Booth : C6/220-9
Contacts: AKEN
Email: [email protected]
HOREXS is a famous Chinese IC substrate manufacturer who professionally has produced 2-6L substrates (buildup types) over 15 years.
? Advanced packaging Substrate Manufacturer ( Wire bonding/
Sip/ FCCSP/FCBGA/ Memory/ Module/etc )
? Since its establishment in 2009, HOREXS already focus on semiconductor packaging substrate manufacturing.
? R&D members have experienced over 30 years in this market
Stable and high reliability product of HOREXS:
Memory substrate including coreless: eMMC/UFS/eMCP/uMCP/MicroSD/USB/UDP/FBGA/DDR4/DDR3/DDR5/DRAM etc.
FCCSP Package substrate;
CSP package substrate;
SiP(System in package) substrate;
Optical electronics(Phontonics) PCB;
uHDI PCB;
RF/Module substrate;
MEMS/CMOS substrate;
FCBGA package substrate;
On development Glass substrate with kep partner now.