Join HOREXS in Munich electronics fair

Join HOREXS in Munich electronics fair

AKEN Cheung 封装基板制造商 AKEN Cheung 封装基板制造商

AKEN Cheung 封装基板制造商

Director . Advanced packaging IC substrate manufacturer. Advantages: Cost reduction with realiability. FCBGA/ FCCSP/ CSP/ SiP/ Module/ BGA memory DDR3/DDR4/DDR5/ mmwave/ Embedded/ PCB substrate, uHDI PCB etc. mSAP

发布日期: 2024年11月1日
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Welcome to join us and discuss the future product of semiconductor!

Booth : C6/220-9

Contacts: AKEN

Email: [email protected]

HOREXS is a famous Chinese IC substrate manufacturer who professionally has produced 2-6L substrates (buildup types) over 15 years.

? Advanced packaging Substrate Manufacturer ( Wire bonding/

Sip/ FCCSP/FCBGA/ Memory/ Module/etc )

? Since its establishment in 2009, HOREXS already focus on semiconductor packaging substrate manufacturing.

? R&D members have experienced over 30 years in this market

Stable and high reliability product of HOREXS:

Memory substrate including coreless: eMMC/UFS/eMCP/uMCP/MicroSD/USB/UDP/FBGA/DDR4/DDR3/DDR5/DRAM etc.

FCCSP Package substrate;

CSP package substrate;

SiP(System in package) substrate;

Optical electronics(Phontonics) PCB;

uHDI PCB;

RF/Module substrate;

MEMS/CMOS substrate;

FCBGA package substrate;

On development Glass substrate with kep partner now.

HOREXS products


HOREXS factory


Yole report


HOREXS-IC Substrate factory HOREXS-IC Substrate factory

HOREXS-IC Substrate factory

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