Issue PCB boards solution!

1. Poor size:

There are many possible reasons for the poor size. It is easy to cause expansion and contraction in the production process of the PCB circuit board factory. The supplier has adjusted the drilling program/graphic ratio/molding CNC program, which may cause problems such as placement and misalignment and poor coordination of structural parts. . Since such problems are difficult to detect and can only be controlled by the supplier's good process, special attention should be paid to the supplier selection.

2. Plate bending and warping:

The reasons that may cause the plate to bend and warp include: supplier selection problem, abnormal production process, poor heavy industry control, improper transportation or storage, the design of the broken hole is not strong enough, and the copper area of each layer is too different. The last two design problems need to be avoided by conducting a design review in the early stage. At the same time, the PCB factory can be asked to simulate the IR conditions of the placement to test, so as to avoid the bad board bending after the furnace. For some thin boards, it can be required to press the wood pulp board up and down during packaging before packaging, to avoid subsequent deformation, and at the same time, add a clamp to prevent the device from being too heavy to bend the board.

3. Poor plug hole:

Poor plug hole is mainly caused by insufficient technical ability of PCB factory or simplified process, which is manifested as insufficient plug hole, exposed copper or false exposed copper in the hole ring. It may cause problems such as insufficient solder volume, short circuit with SMD or assembled devices, and residual impurities in the hole. This problem can be found in the appearance inspection, so it can be controlled in the incoming inspection, and the PCB factory is required to improve it.

4. Poor impedance:

The impedance of the PCB is an important indicator related to the RF performance of the mobile phone. The common problem is that the impedance difference between PCB batches is relatively large. Since the impedance test strips are generally made on the edge of the PCB and will not be shipped with the board, the supplier can be asked to pay the batch of impedance strips and test reports for reference each time they ship. At the same time, it is also required to provide The comparison data of the wire diameter of the board edge and the wire diameter of the board.

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