Introduction to IC Substrate Technology

IC substrates are critical materials in semiconductor packaging, serving as the bridge connecting chips to external circuits. They play a vital role in performance and reliability. With the rapid development of the semiconductor industry, the demands for IC substrate technology have been continuously increasing. HOREXS, as a leading IC substrate manufacturer, is dedicated to providing high-quality, high-performance solutions to meet market needs.

#### About HOREXS

HOREXS is a high-tech company specializing in the research and production of IC substrates. With advanced production equipment and a skilled technical team, HOREXS offers customized solutions for its clients. The IC substrates from HOREXS have successfully passed validation by world-leading semiconductor packaging and testing companies, demonstrating superior performance and reliability. These substrates help clients effectively reduce production costs and enhance production efficiency.

#### IC Substrate Development Trends in 2024

1. High-Density Interconnect Technology: As chip functionality continues to improve, the demand for high-density interconnect technology in IC substrates is increasing. In 2024, HOREXS will continue to make breakthroughs in this field, offering more precise and efficient solutions.

2. Low-Power Material Applications: To meet the requirements for energy conservation and environmental protection, HOREXS is developing low-power materials to enhance the energy efficiency of IC substrates, reducing energy consumption and aligning with green manufacturing trends.

3. Advanced Packaging Technology: With advancements in semiconductor packaging technology, HOREXS is continuously optimizing the packaging processes of IC substrates to improve overall product performance and market competitiveness.

#### IC Substrate Development Trends for the Next 5 Years

1. Heterogeneous Integration: In the coming years, heterogeneous integration technology will be a significant direction for IC substrate development. HOREXS will invest more resources in R&D to achieve the integration of various materials and technologies, enhancing product performance.

2. Flexible Electronics: The development of flexible electronics technology will bring revolutionary changes to IC substrate design and manufacturing. HOREXS is exploring the application of flexible materials to meet the future trend of lightweight and flexible electronic products.

3. Smart Manufacturing: Leveraging artificial intelligence and big data analytics, HOREXS aims to achieve intelligent production of IC substrates, improving production efficiency and product quality, and setting a new benchmark in smart manufacturing.

4. Global Expansion: To better serve global clients, HOREXS plans to expand its global market presence over the next five years, establishing a more comprehensive supply chain system for faster response and service.

HOREXS will continue to uphold its commitment to technological innovation, driving the development of IC substrate technology, and collaborating with clients to create a better future.