Integrated Fan-Out (InFO) Wafer Level Package (WLP) with Antenna in Package (AiP)

The InFOAiP concept allows integrating the antenna directly into the packaging of the RF-Chip rather than having a separate antenna component. The electrical connections are made through high-density redistribution layers (RDL) and fine-pitch through InFO via (TIV) on the package itself. It is a form of advanced packaging for integrated circuits.

?? Why is it exciting? ???

?? Flexibility: The InFO-AiP concept is remarkably flexible, allowing the integration of dipole arrays and patch antennas within the same package.

?? TSMC showcases, the potential lies in seamlessly accommodating various antenna layouts without a major overhaul in the existing InFO process flow.

?? SizeReduction: The AiP/AoP concept brings the gift of smaller packages, making a significant impact on the overall device form factor.

?? Lower Transmission Losses: Amplified the antenna gain performance, by reducing transmission line losses between the RFIC chipset and antenna.

?? Enhanced Efficiency: Brace yourself for improved transmitter efficiency and a receiver noise figure of merit that takes performance up a notch.

??? Cost and Time Savings: The advantages aren't just technical; they extend to the bottom line. Expect decreased system/assembly costs and accelerated time to market.

Reference: TSMC, "3DFabric? for Mobile" https://www.tsmc.com/english/dedicatedFoundry/technology/platform_smartphone_tech_WLSI

Abbreviations:

Integrated Fan-Out (InFO)

Wafer Level Package (WLP)

Antenna in Package (AiP)

Through InFO via (TIV)

Redistribution layers (RDL)

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