Inside the Core: Exploring Server Processor Technology
Introduction
Welcome to the digital backbone of modern technology - servers. In the vast landscape of electronics, servers stand as silent workhorses, orchestrating the seamless flow of data, managing applications, and powering the interconnected world we live in. These electronic powerhouses play a pivotal role in handling the demands of today's computing, networking, and storage needs. Join us on a journey to unravel the significance and functionality of servers in the intricate tapestry of electronic systems.
Performance Uplift for High-End Edge Computing Platforms with the Latest Intel? Xeon? D-2800?and D-1800?Processors
Kontron introduces the COM-HPC? Server Module COMh-sdID based on the Intel? Xeon? D-2800?processor, along with the COMh-sdIL and the COM-Express? basic featuring the Intel? Xeon? D-1800?processor.
The COMh-sdID Server Module, measuring 160?x 160?mm with scalability ranging from 4?to 20?cores, features 4x DIMM sockets supporting up to 512?GB DDR4?memory at 3200?MT/s. Optionally, a soldered NVMe SSD onboard with up to 1?TByte storage capacity is available as a storage medium. It boasts 48x PCIe lanes (32x PCIe Gen4?plus 16x PCIe Gen3?lanes) and 2x Quad LAN interfaces, supporting up to 100?Gbit Ethernet, providing extensive interface and communication options.
In "Size D small" format, the COM-HPC? Server Module COMh-sdIL, with dimensions of 120?x 160?mm, is even more compact than the standard COM-HPC? Size D design (160?x 160?mm). With all components soldered, the module is highly resistant to shock and vibration, making it ideal for outdoor applications. Equipped with 16x PCIe Gen4?plus 16x PCIe Gen3?lanes and a maximum of 64?GB soldered DDR4?memory at 2933?MT/s, it offers a soldered NVMe SSD onboard with up to 1?TByte storage capacity as an optional storage medium.
The COM-Express? basic COMe-bID7, based on the Intel? Xeon? D-1800?processor, offers scalability from 4?to 10?cores in a small form factor, enabling robust and space-saving implementations in harsh environments and under extreme conditions. The module features up to 4x SO-DIMM sockets supporting a maximum of 128?GB memory. Optionally, a soldered NVMe SSD onboard with up to 1?TByte storage capacity is available. With 16x PCIe Gen4?plus 16x PCIe Gen3?lanes and 4x 10GBASE-KR interfaces, it provides ideal support for high data throughput rates in challenging I/O and network structures.
Robust and Scalable High-Performance Modules
All three modules are equipped with SKUs for operation in an extended industrial temperature range of -40?°C to +85?°C and ensuring 24/7?reliability for 10?years. These features guarantee highly robust implementations for harsh environments and extreme conditions within a small mechanical footprint. With scalable performance, complemented by Intel? QuickAssist Technology (QAT) and AI acceleration with Intel? AVX-512, the modules are perfectly suited for use in complex AI applications, high-performance network platforms, and edge servers. Featuring real-time capabilities, low latency, and determinism with Intel? Time Coordinated Computing (TCC) and Time Sensitive Networking (TSN), these platforms are ideal for high-performance IoT edge computing applications.
AMD DELIVERS LEADERSHIP PORTFOLIO OF DATA CENTER AI SOLUTIONS WITH AMD INSTINCT MI300?SERIES
AMD announced the availability of the AMD Instinct? MI300X accelerators – with industry-leading memory bandwidth for generative AI and leadership performance for large language model (LLM) training and inferencing – as well as the AMD Instinct? MI300A accelerated processing unit (APU) – combining the latest AMD CDNA? 3?architecture and “Zen 4” CPUs to deliver breakthrough performance for HPC and AI workloads.
Customers leveraging the latest AMD Instinct accelerator portfolio include Microsoft, which recently announced the new Azure ND MI300x v5?Virtual Machine (VM) series, optimized for AI workloads and powered by AMD Instinct MI300X accelerators. Additionally, El Capitan – a supercomputer powered by AMD Instinct MI300A APUs and housed at Lawrence Livermore National Laboratory – is expected to be the second exascale-class supercomputer powered by AMD and expected to deliver more than two exaflops of double precision performance when fully deployed. Oracle Cloud Infrastructure plans to add AMD Instinct MI300X-based bare metal instances to the company’s high-performance accelerated computing instances for AI. MI300X-based instances are planned to support OCI Supercluster with ultrafast RDMA networking.
Several major OEMs also showcased accelerated computing systems, in tandem with the AMD Advancing AI event. Dell showcased the Dell PowerEdge XE9680?server featuring eight AMD Instinct MI300?Series accelerators and the new Dell Validated Design for Generative AI with AMD ROCm-powered AI frameworks. HPE recently announced the HPE Cray Supercomputing EX255a, the first supercomputing accelerator blade powered by AMD Instinct MI300A APUs, which will become available in early 2024. Lenovo announced its design support for the new AMD Instinct MI300?Series accelerators with planned availability in the first half of 2024. Supermicro announced new additions to its H13?generation of accelerated servers powered by 4th Gen AMD EPYC? CPUs and AMD Instinct MI300?Series accelerators.
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MQTT protocol sets new standard for connectivity and security in Secure Integration Server from Softing Industrial
The Secure Integration Server (SIS) from Softing Industrial Automation offers a structured solution for complex server architectures. It combines various OPC UA servers at the automation level with their associated address spaces. This enables a standardized mapping of these address spaces by the OPC UA Companion Specification. The data provided in this way is then available for IoT cloud applications via a standardized OPC UA interface.
The latest version of the SIS, V1.30, integrates the MQTT protocol (versions 3?and 5), making data integration more secure and flexible.
The most significant benefits include:
Product Manager Andreas R?ck commented on this development:
The integration of the MQTT protocol into our Secure Integration Server underlines our commitment to advanced solutions in industrial data integration. The enhanced security and connectivity features open up new possibilities for efficient and reliable data transmission for our customers.
Next-Gen Digital Signage Solutions with Smart Technologies
IBASE Technology Inc. introduces SI-663-N and SI-663?digital signage players, featuring 13th/12th Gen Intel? Core? processors and Intel? Iris? Xe display chips for superior performance and energy efficiency.
The SI-663-N and SI-663?showcase iSMART energy-saving smart control and Observer advanced remote monitoring technologies and offer versatile connectivity, including HDMI2.0b, DP1.4++, DVI-D interfaces, and USB 3.2?ports. The systems provide multiple M.2?expansion options for storage, 5G/LTE, WiFi, and Bluetooth capabilities, enhancing their customization potential. Added security and reliability are assured with TPM 2.0, vPro, and a watchdog timer. A distinctive feature is the Peripheral Device Power Control (PDPC), optimizing power efficiency for connected peripherals.
The SI-663-N distinguishes itself with an industrial-grade, fanless, and compact design for challenging environments and versatile installation scenarios and weighs 1.6?kg. Slightly lighter at 1.5?kg, the SI-663?with separate flow ventilation mirrors the same cutting-edge features in a compact, easily manageable form. Both models come with Intel Core i7-1265UL processor, 8GB DDR5?4800?SO-DIMM memory and 256GB M.2?storage. These models are certified with CE, FCC Class B, CCC, and run on Windows 10?IoT Enterprise (64-bit) and Linux Ubuntu (64-bit), catering to different operating system needs.
SI-663-N / SI-663?FEATURES:
In conclusion, servers emerge as the unsung heroes in the realm of electronics, diligently processing, storing, and serving data to enable the functionalities we often take for granted. As we navigate the ever-evolving landscape of technology, the role of servers remains paramount in fostering connectivity, efficiency, and innovation. Their silent efficiency ensures the smooth operation of digital infrastructures, underscoring their indispensable presence in shaping the electronic ecosystem. The journey through servers in electronics reveals not just a technological marvel but a fundamental enabler of the interconnected world we inhabit.