Innovations and Strategic Partnerships Shaping the Semiconductor Industry
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Innovations and Strategic Partnerships Shaping the Semiconductor Industry

?? Welcome to this week's edition of The Semiconductor Newsletter, your go-to source for the latest breakthroughs and market trends in the semiconductor industry.

?? This week, we explore strategic collaborations, cutting-edge technologies, and notable market movements. Here’s a snapshot of this week’s top stories:

  1. Rapidus and IBM Advance Chiplet Packaging Technology: A new collaboration aims to establish cutting-edge chiplet packaging for 2nm semiconductors.
  2. VIS and NXP to Build 300mm Wafer Fab in Singapore: A joint venture to enhance production capabilities for mixed-signal and power management products.
  3. Alphawave Semi and Arm Develop Advanced Compute Chiplet: Partnership focuses on scalable performance for AI and HPC applications.
  4. Foxconn to Build Advanced Computing Center in Taiwan: A collaboration with NVIDIA to develop AI-driven intelligent ecosystems.
  5. Saudi Arabia Launches National Semiconductor Hub: An ambitious initiative to establish 50 semiconductor design companies by 2030.
  6. Cisco Introduces $1B AI Investment Fund: Strategic investments to enhance AI readiness and innovation across multiple sectors.
  7. Intel and Partners Utilize Sharp's LCD Plants: Repurposing facilities for semiconductor research, aiding Sharp’s financial stability.
  8. ElevATE Semiconductor and GF Partner on High-Voltage Chips: Collaboration ensures a robust supply chain for commercial and defense applications.
  9. ASML and imec Open High NA EUV Lithography Lab: A new lab to accelerate the adoption of advanced semiconductor manufacturing technologies.
  10. STMicroelectronics Builds SiC Facility in Italy: A €5 billion investment in a fully integrated silicon carbide manufacturing facility.
  11. AIXTRON Expands Production in Italy: Acquiring a new site to increase production capacities and connect with local ecosystems.
  12. Global Semiconductor Sales Rise 15.8% in April: Significant growth indicating positive momentum in the industry.
  13. Samsung Electronics Union Stages Walkout: The first strike highlights growing labor assertiveness in South Korea.
  14. ASML to Ship $380M Machine to TSMC: Advanced EUV machines to enhance TSMC’s semiconductor manufacturing capabilities.
  15. Nvidia Reaches $3 Trillion Market Cap: Driven by AI chip demand, Nvidia becomes the second-largest public company.
  16. Intel Launches New Xeon Chips to Compete with AMD: New processors and AI chips aim to regain market share in the data center sector.

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1. Rapidus and IBM Advance Chiplet Packaging Technology

2nm Chiplet Collaboration

Rapidus Corporation and IBM have announced a strategic partnership to develop chiplet packaging technology for 2nm-generation semiconductors. This collaboration aims to establish mass production technologies for high-performance semiconductors. Rapidus will leverage IBM's advanced packaging technology and extensive experience in the semiconductor industry. The partnership includes joint research and development efforts at IBM’s facilities in North America, aiming to push the boundaries of semiconductor innovation. This initiative is expected to significantly enhance the capabilities of both companies in the semiconductor market.

Rapidus Corp. President Atsuyoshi Koike (2nd from L), IBM Corp. Senior Vice President Dario Gil (3rd from L) and others pose for photos during a press conference in Tokyo on Dec. 13, 2022. (Kyodo)

Strategic International Collaboration

This partnership is part of a larger international effort under Japan's New Energy and Industrial Technology Development Organization (NEDO). The project, "Development of Chiplet and Package Design and Manufacturing Technology for 2nm-Generation Semiconductors," underscores Japan’s commitment to advancing its semiconductor industry. By collaborating with IBM, Rapidus aims to tap into IBM's vast expertise in semiconductor packaging and joint development projects with Japanese manufacturers. This collaboration will position Japan as a key player in the global semiconductor packaging supply chain, enhancing its technological prowess and market presence.


2. VIS and NXP to Build 300mm Wafer Fab in Singapore

Joint Venture for 300mm Fab

Vanguard International Semiconductor Company (VIS) and 恩智浦半导体 have announced a joint venture to establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore. This new 300mm wafer fab will produce mixed-signal, power management, and analog products, targeting automotive, industrial, consumer, and mobile markets. Construction of the facility will begin in the second half of 2024, with production expected to start in 2027. The joint venture will support the production needs of both VIS and NXP, ensuring a reliable supply of high-performance semiconductor products.

Investment and Capacity

The total investment for the initial phase of the project is estimated at $7.8 billion, with VIS and NXP contributing $2.4 billion and $1.6 billion, respectively. The fab is expected to have an output of 55,000 wafers per month by 2029, creating approximately 1,500 jobs in Singapore. This initiative will also involve additional funding from third parties to support long-term capacity infrastructure. The fab will operate as an independent, commercial foundry supplier, providing significant capacity to meet the growing demands of various end markets and enhancing the semiconductor manufacturing landscape in Singapore.


3. Alphawave Semi and Arm Develop Advanced Compute Chiplet

High-Performance Compute Chiplet

Alphawave Semi has partnered with Arm to develop an advanced compute chiplet built on the Arm Neoverse CSS platform. This chiplet is designed for applications in artificial intelligence, high-performance computing (HPC), data centers, and 5G/6G networking infrastructure. The collaboration aims to provide scalable performance and accelerate the development of custom system-on-chip (SoC) technologies. Alphawave's custom silicon design platform includes IO extension chiplets, memory chiplets, and compute chiplets, enhancing their portfolio with cutting-edge technology.

Source:

Enhanced Packaging and Connectivity

The new chiplet integrates Alphawave’s ultra-high-speed connectivity IP and advanced packaging capabilities, featuring technologies such as PCIe Gen 6.0 and 7.0, Universal Chiplet Express (UCIe), 112/224G Ethernet, and HBM subsystems. This strategic integration ensures robust performance and flexibility, catering to next-generation HPC, data center, AI/ML, and 5G/6G infrastructure needs. By leveraging Arm's Neoverse CSS platform and Alphawave’s advanced packaging techniques, the collaboration aims to deliver high-performance custom silicon solutions with reduced time-to-market for their customers.


4. Foxconn to Build Advanced Computing Center in Taiwan

NVIDIA Collaboration

富士康 plans to build an advanced computing center in Kaohsiung, Taiwan, featuring the NVIDIA Blackwell platform. This center will include 64 racks and 4,608 GPUs, focusing on AI, smart manufacturing, electric vehicles (EVs), and smart cities. The project is part of a broader collaboration between Foxconn and 英伟达 , aiming to drive intelligent ecosystems and enhance Foxconn’s capabilities in AI server manufacturing.

Source:

AI and Digital Twin Technologies

The new computing center will leverage NVIDIA Omniverse and Isaac robotics platforms to enhance manufacturing and robotics through AI and digital twin technologies. These advancements will support Foxconn’s initiatives in smart manufacturing, EVs, and smart city platforms. The center is slated for completion by 2026, demonstrating the strong competitiveness brought by AI and the significant impact of Foxconn’s large-scale manufacturing capabilities on the industry.


5. Saudi Arabia Launches National Semiconductor Hub

Developing Semiconductor Design Ecosystem

Saudi Arabia has launched the National Semiconductor Hub, aiming to establish 50 semiconductor design companies by 2030. Supported by a SR1 billion venture capital fund and SR150 million in support products, this initiative is part of the Kingdom’s Vision 2030 plan. The hub will create a robust semiconductor design industry ecosystem, potentially worth over SR50 billion.

Naveed Sherwani, CEO of Rapid Silicon, speaking at the launch of the National Semiconductor Hub in Riyadh.

Strategic Talent Attraction

The hub seeks to attract 25 world-class experts through the premium residency program and train 5,000 engineers in semiconductor design. This initiative follows global semiconductor shortages highlighted by the 2019 epidemic, underscoring the importance of the sector. The hub will drive innovation and position Saudi Arabia as a key player in the semiconductor industry, contributing to its economic diversification and technological advancement.


6. Cisco Introduces $1B AI Investment Fund

AI Ecosystem Expansion

思科 has launched a $1B AI investment fund to support the development of secure AI solutions and bolster the startup ecosystem. The fund will make strategic investments in companies like Cohere, Mistral AI, and Scale AI, aligning with Cisco’s AI innovation strategy. These investments aim to enhance AI readiness and complement Cisco's existing AI capabilities.

Strategic AI Partnerships

Cisco has committed over $200M of the fund to date, focusing on partnerships and product collaborations. The company aims to be an agnostic provider in the AI space, offering comprehensive solutions to its global customer base. Cisco's multi-pronged approach includes building essential technology, securing AI infrastructure, and co-innovating with AI companies to meet the evolving needs of enterprises worldwide.


7. Intel and Partners Utilize Sharp's LCD Plants

Semiconductor Research Initiative

英特尔 and 14 Japanese partners will use Sharp’s underutilized LCD plants for semiconductor production research. This initiative involves repurposing clean rooms in Sharp's facilities to develop new back-end chip production methods. The collaboration aims to reduce research and development costs while providing much-needed income to Sharp, which has faced financial challenges.

Sharp's LCD plant in Kameyama, Mie prefecture, has struggled with?low utilization rates. (Photo by Kento Awashima)

Boosting Utilization

The partnership will utilize Sharp’s LCD facilities in Kameyama and Taki, which are equipped with advanced clean rooms essential for chip production. This move aligns with similar strategies in Japan’s semiconductor industry, where existing LCD production infrastructure is repurposed for semiconductor manufacturing. The initiative is expected to accelerate production capabilities and enhance the competitiveness of Japanese semiconductor manufacturers.


8. ElevATE Semiconductor and GF Partner on High-Voltage Chips

High-Voltage Chip Production

Elevate Semiconductor and GlobalFoundries (GF) have announced a partnership to produce high-voltage chips on GF’s 7HV platform. These chips are essential for commercial semiconductor testing equipment and critical aerospace and defense applications. The collaboration will utilize GF’s Vermont facility to manufacture these chips at scale.

Reliable Supply Chain

This partnership ensures a reliable supply chain for high-voltage chips, meeting the demands of both commercial and national security sectors. GF's 7HV technology platform offers power efficiency and design flexibility, supporting a range of electronic devices. The renewed availability of the 7HV platform will save customers time and costs, avoiding the need for redesigning products with different chip technologies.


9. ASML and imec Open High NA EUV Lithography Lab

High NA EUV Development

ASML and imec have opened the High NA EUV Lithography Lab in Veldhoven, Netherlands, providing access to the first prototype High NA EUV scanner. This facility will support leading-edge logic and memory chipmakers in preparing for high-volume manufacturing by 2025-2026. The lab includes advanced processing and metrology tools, aiding in the development of next-generation semiconductor technologies.

ASML - imec High NA Lab opening celebration in Veldhoven.

Advanced Patterning Ecosystem

The lab's opening marks a significant milestone in the semiconductor industry, enabling the exploration of High NA EUV capabilities. By providing access to advanced tools and resources, ASML and imec aim to de-risk the technology and develop private High NA EUV use cases. The collaboration will enhance the patterning ecosystem, supporting the production of 20 nm pitch metal lines in single exposures and advancing Moore’s Law.


10. STMicroelectronics Builds SiC Facility in Italy

SiC Campus Investment

意法半导体 has announced the construction of a new 200mm silicon carbide (SiC) manufacturing facility in Catania, Italy. This €5 billion investment, including €2 billion from the Italian government under the EU Chips Act, will create a fully integrated SiC campus. The facility will support the mass production of SiC power devices and modules for automotive and industrial applications.

Architect's rendering of complete ST campus in Catania, Italy.

Vertical Integration

The Silicon Carbide Campus will integrate all production steps, from substrate development to module assembly, on one site. This vertical integration will enhance ST’s capabilities in producing high-voltage SiC devices, meeting the growing demand for electrification and energy efficiency. The facility is expected to start production in 2026 and ramp up to full capacity by 2033, positioning ST as a leader in SiC technology.


11. AIXTRON Expands Production in Italy

New Production Site

AIXTRON SE is expanding its European manufacturing presence by acquiring a production site near Turin, Italy. This move aims to increase production capacities and prepare for future market growth. The new location will connect AIXTRON to the strong university and supplier ecosystem in the Piedmont region, benefiting from local expertise and resources.

AIXTRON press conference in Turin with representatives of the government of the Piedmont region.

Strategic Location

The Turin site will enhance AIXTRON's manufacturing capabilities, supporting the expected increase in unit shipments over the coming years. The company plans to ship a significant share of its volume from this location within 2-3 years. The investment strengthens AIXTRON’s European footprint, complementing its existing sites in Germany and the UK and contributing to the region's semiconductor ecosystem.


12. Global Semiconductor Sales Rise 15.8% in April

Significant Growth

The Semiconductor Industry Association (SIA) reported global semiconductor sales of $46.4 billion in April 2024, marking a 15.8% year-over-year increase. This growth indicates positive momentum in the semiconductor market as the industry rebounds from previous challenges. Monthly sales also increased by 1.1% compared to March 2024, showing the first month-to-month growth of the year.

Source:

Regional Performance

Regionally, the Americas, China, and Asia Pacific saw significant year-to-year sales increases, with the Americas leading at 32.4%. However, sales in Europe and Japan decreased slightly. The latest industry forecast by the World Semiconductor Trade Statistics (WSTS) projects strong annual growth, with global sales expected to reach $611.2 billion in 2024 and $687.4 billion in 2025, setting new records for the semiconductor industry.

Source:

13. Samsung Electronics Union Stages Walkout

First Union Strike

The National Samsung Electronics Union (NSEU) staged its first walkout, demanding better pay and working conditions. The one-day strike involved approximately 28,000 members, making up over a fifth of Samsung’s workforce. While the strike is unlikely to impact semiconductor production immediately, it highlights growing labor assertiveness within South Korea's largest conglomerate.

Members?of the National Samsung Electronics Union (NSEU) shout slogans during a rally in front of the company headquarters in Seoul on June 7. ? ? EPA/Jiji

Pay and Conditions Dispute

The union seeks improvements beyond the 5.1% wage increase announced by Samsung, including changes to the performance-based bonus system and additional annual leave. Despite the strike, Samsung stated that production and business activities remained unaffected. The walkout, primarily involving workers from Samsung’s Seoul headquarters, underscores ongoing labor tensions as the company strives to maintain its competitive edge in the global semiconductor market.


14. ASML to Ship $380M Machine to TSMC

Advanced EUV Machine

ASML will deliver its latest high-NA extreme ultraviolet (EUV) machine to Taiwan Semiconductor Manufacturing Company ( 台积公司 ) and Intel by the end of the year. The machine, priced at €350 million, can imprint semiconductors with lines just eight nanometers thick, significantly smaller than the previous generation. This advanced technology is crucial for producing chips used in AI applications and advanced consumer electronics.

ASML high-NA EUV machine.

Industry Impact

TSMC and 英特尔 , key customers of ASML, will use the high-NA EUV machines to enhance their chip manufacturing capabilities. Despite concerns about the machine's high cost, its advanced features are expected to drive significant advancements in semiconductor production. ASML’s unique position as the sole manufacturer of EUV technology underscores its critical role in the semiconductor industry's future.


15. Nvidia Reaches $3 Trillion Market Cap

AI Boom Drives Valuation

英伟达 's market cap surpassed $3 trillion, driven by surging demand for its AI chips. The company’s stock has soared over 3,224% in the past five years, positioning Nvidia as the second-largest public company behind Microsoft. Nvidia’s rapid growth reflects its central role in the AI boom, with its GPUs being essential for developing and deploying advanced AI models.

? Thomson Reuters

Revenue and Growth

In May, Nvidia reported first-quarter earnings of $26 billion, more than triple the previous year’s revenue. The company projects $28 billion in revenue for the current quarter, highlighting the strong demand for its products from tech giants like Google, Microsoft, Meta, Amazon, and OpenAI. Nvidia’s continuous innovation and strategic positioning have cemented its dominance in the AI semiconductor market.


16. Intel Launches New Xeon Chips to Compete with AMD

Next-Gen Xeon Processors

英特尔 has launched its sixth-generation Xeon server processors, aiming to regain market share from AMD in the data center sector. The new processors offer improved performance and efficiency, crucial for handling complex AI workloads. Intel’s market share for x86 data center chips has declined, making this launch vital for its competitive positioning.

Xeon 6, product spectrum.

Competitive Pricing

Intel also introduced the Gaudi 3 AI accelerator chips, priced significantly lower than competitors, positioning them as a cost-effective alternative to Nvidia’s H100 chips. The new Xeon processors and Gaudi 3 chips demonstrate Intel’s commitment to innovation and its strategy to reclaim market share by offering high-performance solutions at competitive prices.


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Stanley Russel

??? Engineer & Manufacturer ?? | Internet Bonding routers to Video Servers | Network equipment production | ISP Independent IP address provider | Customized Packet level Encryption & Security ?? | On-premises Cloud ?

4 个月

The Semiconductor Newsletter brings forth an array of impactful developments shaping the semiconductor industry landscape this week. From collaborations like Rapidus Corporation and IBM's chiplet packaging for 2nm semiconductors to significant investments by companies like Cisco to enhance AI readiness, the industry is witnessing remarkable advancements. Initiatives like Foxconn's computing center with NVIDIA and Saudi Arabia's National Semiconductor Hub underscore global efforts to bolster semiconductor innovation and production. How do you see these strategic partnerships and investments influencing the future trajectory of the semiconductor industry?

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