The Impact of Embedded Systems on Modern Electronics Design
Embedded systems are specialized computer systems designed to perform dedicated functions within larger electronic devices. In the electronics industry, embedded systems are fundamental in creating efficient, reliable, and innovative products, from consumer electronics to industrial automation. As the demand for smarter, more connected devices grows, embedded systems are increasingly shaping how electronics are developed and integrated, enabling advancements in IoT, AI, and real-time processing. This article explores the essential role of embedded systems in electronics, key trends, and their impact on industry innovation.
Pickering Interfaces advanced PXI/PXIe and LXI switching and simulation tools, including a next-gen PXIe embedded controller. They enhanced the Microwave Switch Design Tool to streamline electronic testing and verification.
Pickering Interfaces its range of industry-standard modular PXI/PXIe and LXI signal switching and simulation products for electronic test and verification – including a new single-slot PXIe embedded controller and the recently released updated version of its Microwave Switch Design Tool – on stand #240?in Hall A3?at electronica, taking place from November 12th to 15th, at Messe München in Munich, Germany.
For 60?years, the world's leading trade fair for the electronics industry has showcased rapid technological development across all sectors, from semiconductors and components to assemblies and systems. 70,000?visitors from more than 100?countries will meet with 3,000?exhibitors across 18?halls and over 90,000?m2?of exhibition space. Conferences and forums provide in-depth insights into the latest research and application trends – from automation to electromobility and smart energy. And this year, the show’s theme is how electronics, from AI to green tech and smart cities to wireless, is paving the way for a sustainable, liveable future – the All Electric Society.
“Our modular switching and simulation products are based on familiar open industry standards that ensure long-term availability, shorten development time, and ultimately speed time-to-market,” said Steve Edwards, Switching Product Manager at Pickering. “With expert-level knowledge in architecting switching and simulation systems, we help our customers achieve their test objectives efficiently and deliver products with intuitive tools to enhance development teams’ design efforts and productivity. The result is scalable COTS test systems that can be optimized to meet their needs today and in the future.”
Pickering will launch its next-generation Xeon PXIe embedded controller at the show – the most compact and powerful 3U one-slot embedded controller available for the PXI Express platform. Powered by an 11th-generation Intel Xeon processor, combined with 64?GB DDR4?memory, and with up to 28?GB/s system throughput, the controller will easily support high bandwidth test and measurement applications with future-ready PCIe Gen4?and 10GBASE-T interconnectivity.
The company will also showcase the latest version of its Microwave Switch Design Tool (MSDT) – a free online tool for configuring PXI and LXI RF and microwave switching subsystems with just a few clicks – which was recently updated to add schematic design and simulation capabilities. The latest iteration of this web-based tool accelerates the design to production process – from block diagram to mechanical layout – minimizing risk by enabling engineers to design custom RF switching subsystems with an immediate visual indication of electrical performance.
Also on display will be a prototype of a new 12-slot LXI/USB chassis, scheduled for release in early 2025. With 12?slots in a 2U form factor, engineers can fit up to 24?PXI or PXIe switching, simulation and instrumentation modules in a 4U rack, providing a distinct advantage over traditional PXI chassis. Additionally, the chassis includes a removable embedded controller and power supply. Its USB-compatible and LXI-compliant interfaces facilitate direct control through standard interfaces available on most PCs, providing a cost-effective entry point into modular test and measurement applications.
E.E.P.D. the solution partner for customized and standard embedded computer boards and systems based on x86?and ARM, offers the highest AI performance in the smallest space with the PROFIVE? NUCU series.
Developed and manufactured in Germany, the single-board computers (SBC) in the embedded NUC? standard are based on AMD Ryzen? Embedded 8000?series processors and are designed as high-performance class boards.
With the “Zen 4” x86?core architecture and highly innovative 4?nm process technology, the NUCU series is characterized by excellent performance and energy efficiency. Thanks to the latest RDNA3?RadeonTM graphics architecture and the integrated XDNA Neural Processing Unit as an AI engine with up to 16?TOPS, the SBCs are ideally equipped for the latest applications.
Depending on the CPU variant, up to 8?cores and 16?threads are used. The high number of CPU cores and threads is particularly advantageous for parallel applications. The NUCU series is ideal for applications that require high CPU and/or GPU performance as well as security features such as ECC and hardware TPM. Sample use cases are 3D applications, augmented and virtual reality as well as AI systems, machine learning, IoT edge applications, industrial automation systems, computer vision and much more.
Extensive performance features
Key technical features of the NUCU series are a memory of up to 96?GByte DualChannel DDR5-5600?RAM with ECC support (Error Correction Code), a wide-range input from 10.8?VDC to 26.4?VDC and numerous other security features. In addition to the “AMD Firmware Trusted Platform Module” and a TPM 2.0?chip (Infineon), these also include health monitoring and management with adjustable fan control, hardware monitoring and watchdog.
Other specifications include fast 2.5?GBit Ethernet controllers, PCIe 4.0x4?2280?NVME support and optional wireless module support for 4G / LTE / 5G / WiFi 6. There are various interfaces, e.g. two USB 3.2?Gen 2?ports, two Mini DisplayPort++ and two USB-C DP Alt Mode ports. In addition, multi-monitor applications can be operated with up to four 4K/60Hz monitors.
The SBCs are designed for a commercial operating temperature range from 0?°C to +60?°C. Microsoft? Windows? 11?or Linux Ubuntu 22.04?LTS are used as the operating system.
Choice of powerful CPUs
Different CPUs with a TDP of 15?W - 54?W are available:
Compact and lightweight COM Express Module adopts the latest Intel processor technology
Display solutions and embedded systems provider, Review Display Systems (RDS) has announced the introduction of a new COM Express Type 10?CPU Module from AAEON, a leading provider of Computer-on-Modules.
The AAEON NanoCOM-RAP is powered by 13th Generation Intel Core U-series processors ranging from the Intel Processor U300E to the Intel Core i7-1365UE and offers up to 10?core, 12?threads, and dynamic processor clock speeds using Intel Turbo Boost Technology to deal with heavy workloads. With the combination of high CPU performance and low processor power consumption, the NanoCOM-RAP has been designed and developed for customers who require a small, flexible and scalable computing solution.
AAEON has invested in the module’s memory and storage, equipping the NanoCOM-RAP with up to 16GB of LPDDR5?memory. Additionally, the NanoCOM-RAP offers two SATA drives, while further expansion can be supported with four PCIe slots. A further option of up to 128GB of onboard NVMe is also available.
Integrated Intel UHD Graphics support dual display outputs with DDI (Digital Display Interface) and eDP (embedded DisplayPort) interfaces with display resolutions of up to 3840?x 2160?pixels at 60Hz. This configuration, along with the module’s high-definition audio interface enables the NanoCOM-RAP to support visual-related applications.
AAEON’s COM express module line-up offers flexible interface options, and the NanoCOM-RAP provides a LAN port for Intel Ethernet Controller I226-IT at 2.5GbE and multiple USB ports including eight USB 2.0?and two USB 3.2?Gen 2. These interface options provide flexibility for the integration of peripheral devices such as cameras and sensors.
The NanoCOM-RAP module supports a wealth of serial communication options, including two 2-wire UART, an 8-bit GPIO, SMBus, and I2C, which enable the module to readily support industrial embedded and edge computing applications. The COM Express Type 10?module has a compact mechanical form factor of just 84mm (l) x 55mm (w) which enables integration in small, restricted access environments. A 9v to 15v power input range and onboard TPM 2.0?are also supported. The module supports multiple operating systems, including Windows and Linux, providing flexibility for developers in a wide range of application environments.
The new AAEON NanoCOM-RAP COM Express module is now available from Review Display Systems.
Superior Services, Powerful Partnerships, and Cutting-Edge System on Modules
Under the theme “E2MS+ – Get to know the PHYTEC PLUS,” the Mainz-based company highlights its comprehensive range of services around embedded components. From in-house development and production to customized electronics, embedded security, device management, and imaging solutions, Phytec offers seamless integration with top technology and software partners. Among the latest innovations are new System on Modules (SOMs) and Single Board Computers (SBCs) featuring Phytec’s cutting-edge FPSC module standard, powered by processors from NXP Semiconductors, STMicroelectronics, and Texas Instruments.
Developers of embedded systems face increasingly complex challenges—from security requirements and protection against cyberattacks to connectivity, upgradeability, and software integration and maintenance. Additionally, shorter product lifecycles, component procurement challenges, and skilled labour shortages further complicate development. Phytec’s strategy is to support its customers as best as possible to minimize development time, costs, and risks. Customers benefit from the expertise of the Phytec team and longstanding partnerships, such as those with NXP, STMicroelectronics, Texas Instruments, and other companies who will also join Phytec at the electronica exhibition.
Phytec’s Technology Partners: From LoRaWAN to Modular EV Charging Electronics
As part of its commitment to providing best-in-class solutions, Phytec will present alongside its key technology partners: Actron, Miromico, and Pionix. These collaborations expand Phytec’s embedded expertise, offering customers seamless integration for a variety of applications. Actron’s 7” and 10.1” IPS displays are directly supported by Phytec development kits, allowing rapid entry into product development. Miromico strengthens Phytec’s portfolio in IoT integration and LoRaWAN, offering customers tailored electronics and development support from a single source. In partnership with Pionix, Phytec has developed modular electronics for EV charging controllers, resulting in the phyVERSO-EVCS. This solution is perfectly paired with Pionix BaseCamp, an open-source-based operating system for charging stations, supporting all standards from charging processes to energy management and adjacent e-mobility services.
Comprehensive Software and Hardware Integration
One of Phytec’s standout offerings is its comprehensive support for embedded software and middleware, along with extensive services. This includes the phyKNOX Embedded Security package, which provides a dedicated Linux security distribution, continuous monitoring of potential security threats, and maintenance services for software. Phytec also collaborates with Qbee to present joint solutions for Linux device management, over-the-air (OTA) software updates, and secure remote access. Additionally, IBV, another long-term partner of Phytec, will showcase its EtherCAT solutions, featuring a Master Stack and Configuration Library optimized for multiple phyBOARD Single Board Computers.
New System on Modules and Single Board Computers
In addition to showcasing its extensive services and partnerships, Phytec will highlight its latest products at electronica. The company will present SOMs and SBCs featuring the latest processors, including SOMs with the NXP i.MX 95?and a preview of the first module with the TI AM6x processor, are both based on Phytec’s FPSC (Future Proof Solder Core) standard. The FPSC standard features a unique footprint with distinct zones that enable scalable performance, interchangeability, and upgrade options, ensuring flexibility for future innovations. This results in maximum investment security for designs built on the FPSC standard.
Phytec will also debut the phyCORE-i.MX 91?SOM with the NXP i.MX 91?processor. It is a very price-attractive embedded module which is fully pin-compatible with phyCORE-i.MX 93.
Conclusion
As technology continues to evolve, embedded systems are central to advancing the electronics industry, offering powerful solutions that enable smarter, more adaptive devices. From enhancing processing capabilities to enabling IoT and AI integrations, embedded systems drive efficiency, innovation, and competitiveness in electronics. Embracing the latest developments in embedded systems will allow companies to remain at the forefront of technology, offering products that meet modern demands for intelligence, connectivity, and reliability.