IC carrier board is about to embrace historic opportunities

Recent chip industry chain to keep autonomous control referred to the unprecedented height, due to China's chip industry has emerged a large number of backbone enterprises grasp core technology, such as the upstream design of huawei haisi, smic middle chip manufacturing, downstream encapsulated long telegram, science and technology in the process of the international semiconductor industry constantly shift to the mainland, IC board will benefit in the process, today we discuss the potential at the key industry.

I. what is IC board

IC carrier board is a technology developed with the continuous progress of semiconductor packaging technology. In the mid-1990s, a new type of IC high-density packaging represented by ball-gate array packaging and chip size packaging came into being, and IC carrier board emerged as a new packaging carrier.

IC board is developed on the basis of HDI board. As a high-end PCB board, it has the characteristics of high density, high precision, miniaturization and thinness.

IC board is also called package base board. In the field of high-order packaging, IC board has replaced the traditional lead frame and become an indispensable part of chip packaging. It not only provides support, heat dissipation and protection for the chip, but also provides electronic connection between the chip and PCB motherboard, playing the role of "connecting up and down".Even can be embedded passive, active devices to achieve certain system functions.

IC board is about to embrace historic opportunities

Ii. Introduction of IC board products

IC board products are roughly divided into five categories, including memory chip IC board, microelectromechanical system IC board, rf module IC board, processor chip IC board and high-speed communication IC board, which are mainly used in mobile intelligent terminals, services/storage.

IC board is about to embrace historic opportunities

According to different packaging technology, IC board can be divided into lead bonding IC board and flip IC board.Among them, lead bonding (WB) USES thin metal wire, and USES heat, pressure and ultrasonic energy to make the metal wire close to the chip pad and substrate pad, so as to realize the electrical interconnection between the chip and substrate and the information exchange between the chips. It is widely used in the packaging of rf modules, memory chips and mems devices.

Different from lead bonding, FC encapsulation USES a welding ball to connect the chip to the substrate, that is, a welding ball is formed on the chip's welding pad, and then the chip is flipped onto the corresponding substrate to realize the combination of the chip and the substrate by heating the molten welding ball. This packaging technology has been widely used in the packaging of CPU, GPU, Chipset and other products.

Three, IC board industry analysis

The capacity expansion of fab drives the market demand of IC board.The main task of a wafer factory is to etch silicon wafers into wafers, that is, the raw materials of chips. The demand and sales of wafers directly determine the number of chips that can be produced, and indirectly determine the fate of IC plates.

From 2018 to 2020, the newly built domestic fabs will directly boost the demand for IC boards, and the leading domestic PCB enterprises will certainly increase their investment in IC boards, so that the board market will get better development in the competition.

IC board is about to embrace historic opportunities

At present, the global IC board market has reached $8.311 billion, and the corresponding IC board for storage accounts for about 13% of the market, that is, the market size is about $1.1 billion.

IC board is about to embrace historic opportunities

With the development of 5G technology and the continuous practice of the concept of the Internet of things, 5G and the Internet of things are expected to lead the fourth cycle of silicon content improvement in the world, continue to drive the growth of the semiconductor industry, and thus drive the growth of the demand for upstream materials such as IC carrier boards.It is estimated that the market size of IC board industry in China is expected to reach 41.235 billion yuan by 2025.