Huawei M60: A Controversial Phone with Impressive Specs
Alex Joseph Varghese
Building Resilient Semiconductor Supply Chains | Growth Strategist & Operations Expert
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Huawei has unveiled its new flagship phone, the M60. The phone boasts a number of impressive specs, including a powerful Kirin 9100 chipset, a 6.6-inch AMOLED display with a 120Hz refresh rate, and a quad-camera system with a 50MP main sensor.
The M60 is expected to be released in China in October 2023. It is unclear whether the phone will be released in other markets.
Here are some of the Huawei M60's key features:
- Powerful Kirin 9100 chipset: The Kirin 9100 is Huawei's latest flagship chipset. It is a 4nm octa-core chipset with a clock speed of up to 3.1GHz. The chipset is also equipped with a Mali-G710 MP10 GPU.
- High-refresh-rate display: The M60 has a 6.6-inch AMOLED display with a 120Hz refresh rate. This means that the display is able to refresh its image 120 times per second. This results in a smoother and more immersive viewing experience.
- Quad-camera system: The M60 has a quad-camera system with a 50MP main sensor, a 12MP ultrawide sensor, an 8MP telephoto sensor, and a 5MP macro sensor. The main sensor is a Sony IMX766 sensor. It is a large 1/1.56-inch sensor with OIS. The ultrawide sensor has a 120-degree field of view. The telephoto sensor has a 3x optical zoom. The macro sensor can take photos of objects as close as 2.5cm away.
- HarmonyOS 3.0: The M60 runs HarmonyOS 3.0. HarmonyOS is Huawei's own operating system. It is based on Android, but it does not have Google Mobility Services. HarmonyOS 3.0 has a number of new features, new design, improved performance, and a wider range of apps.
It is alleged that the Kirin 9000S chipset, which is used in Huawei's latest flagship smartphone, the Mate 60 Pro 5G, may have violated US sanctions. This is because the chipset is manufactured using SMIC's 7nm process(similar to TSMC 10nm or Intel 7nm), which is known as the N+2 node.
Some US lawmakers have called for an investigation into whether SMIC violated sanctions by supplying the Kirin 9000S to Huawei.
My thoughts
The narrative that SMIC evaded US sanctions to make 7nm technology is indeed absurd. Most likely, SMIC is using a process called SAMP (self-aligned multiple patterning) with their non-export controlled lithography toolset to make 7nm chips, which does not require EUV lithography. However, this process has a very low yield, meaning that only a small percentage of chips are actually produced correctly. This is why the Huawei Mate 60, which is rumored to use SMIC's 7nm chips, is only available in limited quantities.
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The US sanctions were put in place to slow down China's technological advancement, and they have been somewhat successful in doing so. However, China is still making progress in the development of its semiconductor industry, and it is possible that they will eventually be able to produce 7nm chips with high yield using DUV lithography. This would be a major breakthrough for China, and it would significantly reduce their reliance on foreign technology.
In the meantime, China is also investing heavily in the development of its own EUV lithography technology. This is a long-term project, but it is essential if China wants to become a major player in the global semiconductor industry.
SMEE, or Shanghai Microelectronics Equipment, is China's leading lithography machine maker. They are currently developing their own EUV lithography technology, and they are hoping to be able to produce commercial-grade EUV machines by the end of the decade. If they are successful, this would be a major breakthrough for China's semiconductor industry, and it would significantly reduce their reliance on foreign technology.
SMEE is also producing DUV lithography machines, which are the most advanced machines that China can currently produce without US technology. These machines are being used by Chinese chipmakers to produce 7nm chips, albeit with low yields.
In addition, China is also investing in research and development in the semiconductor industry. They are working on new materials and processes that could make it possible to produce chips with even smaller features. China is also working to develop its own ecosystem of chip designers, manufacturers, and suppliers. This would allow China to produce chips that are tailored to its specific needs.
An even more impressive feat is Huawei designing its own SoC architecture and integrated modem after being sanctioned by the West back in 2019. Even Apple has not managed to wean itself off Qualcomm to create its own 5G modem chip.
Overall, I think the situation is still fluid, and it is too early to say what the long-term impact of the US sanctions will be. However, it is clear that China is not giving up on its ambitions in the semiconductor industry, and they are making steady progress.
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what's the features of that m60 ?