How much do you know about 4 common packaging methods for electronic components?

1. Tape packaging

In the chip specification book, it is usually represented by Reel, which means tape, commonly known as reel packaging. This is the most common packaging method in SMT, because SMT uses automated equipment and needs to be mounted on a machine rack to achieve automatic patching. Tape and reel is the most commonly used format. It can be said that among chip materials, more than 90% of the materials are taped and packaged, which can achieve the best level of automated production. Of course, many products can only be made in the taping method. Generally speaking, we use the taping method. The best choice.

2. Pallet packaging

For some IC chips, especially QFP/TQFP/BGA (when the number of pins is greater than 48), due to the increase in size, the general packaging form of this type of chips is a tray, and generally there is not much room for choice. In order to ensure that the IC pins do not deform, taping packaging may not be suitable for QFP/TQFP, so making it into a tray may help protect the pins.

For some TQFP chips with small pin count and small size, there are both tape and tray packaging. At this time, we still prefer tape. Because of the large size of pallet packaging in SMT, the quantity of each package is relatively small. After unpacking, each pallet must be inspected to confirm the pin deformation, and then the entire unpacking, inspection, and placement operations are all manual operations. If it is touched by hands, there is a high probability of adverse effects on the chip pins or falling.

3. Tube installation

This is not recommended. Tube packaging is a very magical existence. With the development of SMT and chips for so many years, there seems to be a large number of tube packaging, or even only tube packaging options. For 8-pin, 16-pin, and 20-pin SOP chips, tube packaging and tape packaging almost coexist. Considering that the manufacturer's packaging method is distinguished by material number, there are options for both, and they should be used according to the actual situation. .

The current tube packaging method is not very effective and the process is extremely unstable, which also affects efficiency, so it has not become mainstream in the industry. Therefore, the current approach is to pour the chips out of the tube and reinstall them on the tray to simulate the second method mentioned above.

4. Bulk

This is really a last resort option. Needless to say, bulk materials can only be operated by hand on the PCB board. As you can imagine, batch operation is not possible, which affects quality and efficiency. Generally, chips will not have bulk materials, but may be other components, such as power LED lights/FPC holders, etc. The supplier will deliver them in a packaging bag. This kind of product is only suitable for small batch production in small workshops and factories, or for research and development testing, but is not suitable for normal mass production.

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